Semiconductor device packages and stacked package assemblies including high density interconnections

ABSTRACT

A method of forming a semiconductor device package includes: (1) providing an electronic device including an active surface and a contact pad adjacent to the active surface; (2) forming a package body encapsulating portions of the electronic device; and (3) forming a redistribution stack, including: forming a dielectric layer over a front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of the contact pad; and forming a redistribution layer (RDL) over the dielectric layer, the RDL including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace, wherein the second portion of the first trace is disposed between and spaced from opposing sidewalls of the dielectric layer defining the first opening.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/615,665 filed Jun. 6, 2017, which claims the benefit of U.S.Provisional Application No. 62/424,901 filed Nov. 21, 2016, and claimsthe benefit of U.S. Provisional Application No. 62/373,803 filed Aug.11, 2016, the contents of which are incorporated herein by reference intheir entireties.

BACKGROUND 1. Field of the Disclosure

The present disclosure relates to high density interconnections insemiconductor device packages and stacked package assemblies.

2. Description of the Related Art

To address a trend towards miniaturization and increased functionality,a semiconductor device package can integrate multiple electronic deviceswithin the package, where the electronic devices are interconnectedthrough redistribution layers (RDLs). As more functionality isincorporated into electronic devices, a number of requisitedevice-to-device interconnections within a semiconductor device packagehas dramatically increased. The increased number of device-to-deviceinterconnections places considerable constraint on an available routingarea for traces of RDLs. To provide interconnections, RDLs can includerelatively large capture pads having dimensions larger than a width oftraces. These capture pads occupy valuable footprint area and impedeagainst a high density of traces which can be routed between adjacentcapture pads.

It is against this background that a need arose to develop embodimentsof this disclosure.

SUMMARY

In one aspect according to some embodiments, a method of forming asemiconductor device package includes: (1) providing an electronicdevice including an active surface and a contact pad adjacent to theactive surface; (2) forming a package body encapsulating portions of theelectronic device; and (3) forming a redistribution stack, including:forming a dielectric layer over a front surface of the package body, thedielectric layer defining a first opening exposing at least a portion ofthe contact pad; and forming a redistribution layer (RDL) over thedielectric layer, the RDL including a first trace, wherein the firsttrace includes a first portion extending over the dielectric layer alonga first longitudinal direction adjacent to the first opening, and asecond portion disposed in the first opening and extending between thefirst portion of the first trace and the exposed portion of the contactpad, wherein the second portion of the first trace has a maximum widthalong a first transverse direction orthogonal to the first longitudinaldirection, and the maximum width of the second portion of the firsttrace is no greater than 3 times of a width of the first portion of thefirst trace, wherein the second portion of the first trace is disposedbetween and spaced from opposing sidewalls of the dielectric layerdefining the first opening.

In another aspect according to some embodiments, a method of forming asemiconductor device package includes: (1) providing an electronicdevice including an active surface and a contact pad adjacent to theactive surface; (2) providing a conductive post over the contact pad ofthe electronic device; (3) forming a package body encapsulating portionsof the electronic device and portions of the conductive post, whereinthe package body includes a front surface and a back surface opposite tothe front surface, and the conductive post extends between the contactpad of the electronic device and the front surface of the package body;and (4) forming a redistribution stack, including: forming a dielectriclayer over the front surface of the package body, the dielectric layerdefining a first opening exposing at least a portion of a terminal endof the conductive post; and forming an RDL over the dielectric layer,the RDL including a first trace, wherein the first trace includes afirst portion extending over the dielectric layer, and a second portiondisposed in the first opening and extending between the first portion ofthe first trace and the exposed portion of the terminal end of theconductive post, wherein the first portion of the first trace extendsover the dielectric layer along a longitudinal direction adjacent to thefirst opening, the second portion of the first trace has a maximum widthalong a transverse direction orthogonal to the longitudinal direction,and the maximum width of the second portion of the first trace is nogreater than 3 times of a width of the first portion of the first trace,wherein the second portion of the first trace is disposed between andspaced from opposing sidewalls of the dielectric layer defining thefirst opening.

In another aspect according to some embodiments, a method of forming asemiconductor device package includes: (1) providing a package bodyincluding a front surface and a back surface opposite to the frontsurface; and (2) forming a redistribution stack adjacent to the frontsurface of the package body, including: forming a first RDL including afirst trace; forming a dielectric layer disposed over the first RDL; andforming a second RDL including a second trace extending over thedielectric layer and electrically connected to the first trace throughthe dielectric layer, wherein a width of the first trace issubstantially uniform along at least a length of the first traceoverlapping the second trace disposed over the first trace, wherein thedielectric layer defines an opening exposing a portion of the firsttrace, and the exposed portion of the first trace is disposed betweenand spaced from opposing sidewalls of the dielectric layer defining theopening.

In another aspect according to some embodiments, a method of forming asemiconductor device package includes: (1) providing a package bodyincluding a front surface and a back surface opposite to the frontsurface; and (2) forming a redistribution stack adjacent to the frontsurface of the package body, including: forming an RDL including atrace; forming a dielectric layer disposed over the RDL; and forming anunder bump metallization (UBM) disposed over the dielectric layer andelectrically connected to the trace through the dielectric layer,wherein a portion of the trace overlaps a projection area of the UBMonto the RDL, the trace extends along a longitudinal direction adjacentto the projection area, the overlapping portion of the trace has amaximum width along a transverse direction orthogonal to thelongitudinal direction, the UBM has a maximum width along the transversedirection, and the maximum width of the overlapping portion of the traceis no greater than ⅓ of the maximum width of the UBM, wherein thedielectric layer defines an opening exposing a portion of the trace, andthe exposed portion of the trace is disposed between and spaced fromopposing sidewalls of the dielectric layer defining the opening.

In a further aspect according to some embodiments, a method of forming asemiconductor device package includes: (1) forming a redistributionstack, including: forming a conductive pad; forming a dielectric layer,wherein the conductive pad is at least partially embedded in thedielectric layer; and forming an RDL including a trace extending overthe dielectric layer and electrically connected to the conductive padthrough an opening in the dielectric layer; and (2) forming a packagebody including a front surface and a back surface opposite to the frontsurface, the front surface of the package body adjacent to theredistribution stack, wherein the opening in the dielectric layerexposes a portion of the conductive pad, the trace includes a firstportion extending over the dielectric layer along a longitudinaldirection adjacent to the opening, and a second portion disposed in theopening and extending between the first portion of the trace and theexposed portion of the conductive pad, the second portion of the tracehas a maximum width along a transverse direction orthogonal to thelongitudinal direction, and the maximum width of the second portion ofthe trace is no greater than 3 times of a width of the first portion ofthe trace, wherein the second portion of the trace is disposed betweenand spaced from opposing sidewalls of the dielectric layer defining theopening.

Other aspects and embodiments of this disclosure are also contemplated.The foregoing summary and the following detailed description are notmeant to restrict this disclosure to any particular embodiment but aremerely meant to describe some embodiments of this disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the nature and objects of some embodimentsof this disclosure, reference should be made to the following detaileddescription taken in conjunction with the accompanying drawings. In thedrawings, like reference numbers denote similar components, unless thecontext clearly dictates otherwise.

FIG. 1 shows a cross-sectional view of a semiconductor device packageaccording to some embodiments of this disclosure.

FIG. 1A shows a cross-sectional view of a semiconductor device packageaccording to some embodiments of this disclosure.

FIG. 2, FIG. 3, and FIG. 4 show a comparison structure of a contactpad-to-RDL interconnection, where FIG. 2 is a top view, FIG. 3 is across-sectional view taken along line A-A of FIG. 2, and FIG. 4 is across-sectional view taken along line B-B of FIG. 2.

FIG. 5, FIG. 6, and FIG. 7 show a structure of a high density contactpad-to-RDL interconnection according to some embodiments, where FIG. 5is a top view, FIG. 6 is a cross-sectional view taken along line C-C ofFIG. 5, and FIG. 7 is a cross-sectional view taken along line D-D ofFIG. 5.

FIG. 8 shows a top view of a structure of a high density contactpad-to-RDL interconnection according to some embodiments.

FIG. 9, FIG. 10, and FIG. 11 show a comparison structure of anRDL-to-RDL interconnection, where FIG. 9 is a top view, FIG. 10 is across-sectional view taken along line E-E of FIG. 9, and FIG. 11 is across-sectional view taken along line F-F of FIG. 9.

FIG. 12, FIG. 13, FIG. 14, and FIG. 15 show a structure of a highdensity RDL-to-RDL interconnection according to some embodiments, whereFIG. 12 is a top view, FIG. 13 is a magnified top view of a selectedregion of FIG. 12 (shown by a dashed box in FIG. 12), FIG. 14 is across-sectional view taken along line G-G of FIG. 13, and FIG. 15 is across-sectional view taken along line H-H of FIG. 13.

FIG. 16 shows a top view of a structure of a high density RDL-to-RDLinterconnection according to some embodiments.

FIG. 17 shows a top view of a structure of a high density RDL-to-RDLinterconnection according to some embodiments.

FIG. 18 shows a top view of a structure of a high density RDL-to-RDLinterconnection according to some embodiments.

FIG. 19 and FIG. 20 show a comparison structure of an RDL-to-UBMinterconnection, where FIG. 19 is a top view, and FIG. 20 is across-sectional view taken along line I-I of FIG. 19.

FIG. 21, FIG. 22, and FIG. 23 show a structure of a high densityRDL-to-UBM interconnection according to some embodiments, where FIG. 21is a top view, FIG. 22 is a cross-sectional view taken along line J-J ofFIG. 21, and FIG. 23 is a cross-sectional view taken along line K-K ofFIG. 21.

FIG. 24 shows a top view of a structure of a high density RDL-to-UBMinterconnection according to some embodiments.

FIG. 25 shows a cross-sectional view of a semiconductor device packageaccording to some embodiments of this disclosure.

FIG. 26, FIG. 27, and FIG. 28 show a structure of a high densityconductive post-to-RDL interconnection according to some embodiments,where FIG. 26 is a top view, FIG. 27 is a cross-sectional view takenalong line L-L of FIG. 26, and FIG. 28 is a cross-sectional view takenalong line M-M of FIG. 26.

FIG. 29 shows a cross-sectional view of a semiconductor device packageaccording to some embodiments of this disclosure.

FIG. 30, FIG. 31, and FIG. 32 show a structure of a high densityconductive pad-to-RDL interconnection according to some embodiments,where FIG. 30 is a top view, FIG. 31 is a cross-sectional view takenalong line N-N of FIG. 30, and FIG. 32 is a cross-sectional view takenalong line O-O of FIG. 30.

FIG. 33 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 34 is a cross-sectional view of a semiconductor device packagetaken along a plane P-P of FIG. 33, according to some embodiments ofthis disclosure.

FIG. 35 shows a top view of a structure of a high density conductivevia-to-RDL interconnection according to some embodiments.

FIG. 36 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 37 is a cross-sectional view of a semiconductor device packagetaken along a plane Q-Q of FIG. 36, according to some embodiments ofthis disclosure.

FIG. 38 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 39 is a cross-sectional view of a semiconductor device packagetaken along a plane R-R of FIG. 38, according to some embodiments ofthis disclosure.

FIG. 40 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 41 is a cross-sectional view of a semiconductor device packagetaken along a plane S-S of FIG. 40, according to some embodiments ofthis disclosure.

FIG. 42 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 43 is a cross-sectional view of a semiconductor device packagetaken along a plane T-T of FIG. 42, according to some embodiments ofthis disclosure.

FIG. 44 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 45 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 46 is a cross-sectional view of a semiconductor device packagetaken along a plane U-U of FIG. 45, according to some embodiments ofthis disclosure.

FIG. 47 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 48 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 49 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 50 shows a cross-sectional view of a stacked package assemblyaccording to some embodiments of this disclosure.

FIG. 51A, FIG. 51B, FIG. 51C, FIG. 51D, FIG. 51E, FIG. 51F, FIG. 51G,and FIG. 51H show a sequence of stages of a manufacturing process of asemiconductor device package, according to some embodiments of thisdisclosure.

FIG. 52A, FIG. 52B, FIG. 52C, FIG. 52D, FIG. 52E, FIG. 52F, FIG. 52G,FIG. 52H, FIG. 52I, and FIG. 52J show a sequence of stages of forming ahigh density contact pad-to-RDL interconnection according to someembodiments of this disclosure.

FIG. 53A, FIG. 53B, FIG. 53C, FIG. 53D, FIG. 53E, FIG. 53F, FIG. 53G,and FIG. 53H show a sequence of stages of forming a high densityRDL-to-RDL interconnection according to some embodiments of thisdisclosure.

FIG. 54A, FIG. 54B, FIG. 54C, FIG. 54D, FIG. 54E, FIG. 54F, and FIG. 54Gshow a sequence of stages of forming a high density RDL-to-UBMinterconnection according to some embodiments of this disclosure.

FIG. 55A, FIG. 55B, FIG. 55C, FIG. 55D, FIG. 55E, and FIG. 55F show asequence of stages of a manufacturing process of a semiconductor devicepackage, according to some embodiments of this disclosure.

FIG. 56A, FIG. 56B, FIG. 56C, FIG. 56D, FIG. 56E, and FIG. 56F show asequence of stages of forming a high density conductive post-to-RDLinterconnection according to some embodiments of this disclosure.

FIG. 57A, FIG. 57B, FIG. 57C, FIG. 57D, FIG. 57E, and FIG. 57F show asequence of stages of a manufacturing process of a semiconductor devicepackage, according to some embodiments of this disclosure.

FIG. 58A, FIG. 58B, FIG. 58C, FIG. 58D, FIG. 58E, and FIG. 58F show asequence of stages of forming a high density conductive pad-to-RDLinterconnection according to some embodiments of this disclosure.

FIG. 59A, FIG. 59B, FIG. 59C, FIG. 59D, FIG. 59E, FIG. 59F, FIG. 59G,and FIG. 59H show a sequence of stages of a manufacturing process of astacked package assembly, according to some embodiments of thisdisclosure.

FIG. 60A, FIG. 60B, FIG. 60C, FIG. 60D, FIG. 60E, and FIG. 60F show asequence of stages of forming a high density conductive via-to-RDLinterconnection according to some embodiments of this disclosure.

FIG. 61A, FIG. 61B, FIG. 61C, FIG. 61D, and FIG. 61E show a sequence ofstages of a manufacturing process of a stacked package assembly,according to some embodiments of this disclosure.

FIG. 62A, FIG. 62B, and FIG. 62C show a sequence of stages of amanufacturing process of a stacked package assembly, according to someembodiments of this disclosure.

FIG. 63A, FIG. 63B, FIG. 63C, FIG. 63D, and FIG. 63E show a sequence ofstages of a manufacturing process of a stacked package assembly,according to some embodiments of this disclosure.

FIG. 64A, FIG. 64B, FIG. 64C, and FIG. 64D show a sequence of stages ofa manufacturing process of a stacked package assembly, according to someembodiments of this disclosure.

FIG. 65A, FIG. 65B, FIG. 65C, and FIG. 65D show a sequence of stages ofa manufacturing process of a stacked package assembly, according to someembodiments of this disclosure.

FIG. 66A, FIG. 66B, FIG. 66C, FIG. 66D, FIG. 66E, and FIG. 66F show asequence of stages of a manufacturing process of a stacked packageassembly, according to some embodiments of this disclosure.

FIG. 67A, FIG. 67B, FIG. 67C, and FIG. 67D show a sequence of stages ofa manufacturing process of a stacked package assembly, according to someembodiments of this disclosure.

FIG. 68A, FIG. 68B, FIG. 68C, and FIG. 68D show a sequence of stages ofa manufacturing process of a stacked package assembly, according to someembodiments of this disclosure.

FIG. 69A, FIG. 69B, and FIG. 69C show a sequence of stages of amanufacturing process of a stacked package assembly, according to someembodiments of this disclosure.

FIG. 70 shows a stage of a manufacturing process of a stacked packageassembly, according to some embodiments of this disclosure.

DETAILED DESCRIPTION

Some embodiments of this disclosure are directed to high densityinterconnections in semiconductor device packages, using RDLs which omitcapture pads. In some embodiments, a semiconductor device packageincludes multiple electronic devices, which can include one or moreactive devices, one or more passive devices, or a combination thereof.Within the semiconductor device package, high density interconnectionsusing RDLs provide a high density of signal, power, and ground tracesconnecting the electronic devices within the package as well as a highdensity of traces providing connections external to the package. Forexample, the RDLs provide a high density of device-to-deviceinterconnections (e.g., die-to-die or die-to-passive deviceinterconnections). In some embodiments, high density interconnectionsare attained through one or more of the following interconnectionstructures: contact pad-to-RDL interconnections; RDL-to-RDLinterconnections; RDL-to-UBM interconnections; conductive post-to-RDLinterconnections; and conductive pad-to-RDL interconnections. In someembodiments, high density interconnections are attained through tracesextending into or through dielectric openings with capture pads omitted.

Some embodiments of this disclosure are directed to high densityinterconnections in a variety of semiconductor device packages,including high density interconnections in wafer-level semiconductordevice packages (e.g., wafer-level chip scale packages (WLCSPs)) andhigh density interconnections in fan-out or fan-in semiconductor devicepackages, and the formation of such interconnections in wafer-levelpackaging processes and fan-out or fan-in packaging processes (e.g.,using wafers or panels, for example, round, rectangular, or squarepanels).

Referring to FIG. 1, a cross-sectional view is shown of a semiconductordevice package 1000 according to some embodiments of this disclosure.The semiconductor device package 1000 includes multiple electronicdevices, including an electronic device 1002 and an electronic device1004. As illustrated, each of the electronic devices 1002 and 1004 is anactive device corresponding to a semiconductor die or chip, although itis contemplated that the electronic devices 1002 and 1004, in general,can be any active devices, any passive devices, or a combinationthereof. The electronic device 1002 includes an active surface 1008, aback surface 1010 opposite to the active surface 1008, and contact pads1012 adjacent to the active surface 1008. The contact pads 1012 provideinput and output electrical connections for an integrated circuit withinthe electronic device 1002. Similarly, the electronic device 1004includes an active surface 1014, a back surface 1016 opposite to theactive surface 1014, and contact pads 1018 adjacent to the activesurface 1014, and where the contact pads 1018 provide input and outputelectrical connections for an integrated circuit within the electronicdevice 1004. While the two electronic devices 1002 and 1004 are shown inthe cross-sectional view of the semiconductor device package 1000, it iscontemplated that a single electronic device or more than two electronicdevices can be included in the semiconductor device package 1000 ofother embodiments.

As shown in FIG. 1, the semiconductor device package 1000 also includesa package body 1006 that covers or encapsulates portions of theelectronic device 1002 and portions of the electronic device 1004. Thepackage body 1006 can provide mechanical stability as well as protectionagainst oxidation, humidity, and other environmental conditions.Referring to FIG. 1, the package body 1006 covers the back surfaces 1010and 1016 and lateral sides of the electronic devices 1002 and 1004, withtheir active surfaces 1008 and 1014 at least partially exposed from oruncovered by the package body 1006. The package body 1006 includes afront surface 1020 and a back surface 1022 opposite to the front surface1020. The package body 1006 can be formed from, or can include, amolding material. The molding material can include, for example, aNovolac-based resin, an epoxy-based resin, a silicone-based resin, oranother suitable encapsulant. Suitable fillers can also be included,such as powdered silica. The molding material can be a pre-impregnatedmaterial, such as a pre-impregnated dielectric material. Throughimplementation of high density interconnections within the semiconductordevice package 1000, the electronic devices 1002 and 1004 encapsulatedby the package body 1006 can be disposed in close proximity, or can be“brick-walled” so as to be nearly abutting with a narrow gap between theelectronic devices 1002 and 1004 filled with a molding material.

The semiconductor device package 1000 also includes a redistributionstack of one or more RDLs and one or more dielectric layers disposedover the active surfaces 1008 and 1014 of the electronic devices 1002and 1004 and the front surface 1020 of the package body 1006. Asillustrated, a dielectric layer 1024 is disposed over the electronicdevices 1002 and 1004 and the package body 1006, an RDL 1026 is disposedover the dielectric layer 1024, a dielectric layer 1028 is disposed overthe RDL 1026, an RDL 1030 is disposed over the dielectric layer 1028, adielectric layer 1032 is disposed over the RDL 1030, an RDL 1034 isdisposed over the dielectric layer 1032, and a dielectric layer 1036 isdisposed over the RDL 1034.

The RDL 1026 is a patterned conductive layer that includes multipletraces, including traces 1026 a and 1026 b, and at least some of thetraces of the RDL 1026 extend into openings 1024 o in the dielectriclayer 1024 to electrically connect to the contact pads 1012 and 1018 ofthe electronic devices 1002 and 1004. At least some of the traces of theRDL 1026, such as the trace 1026 b, extend between the contact pads 1012and 1018 of the electronic devices 1002 and 1004 to providedevice-to-device interconnections, although it is noted thatdevice-to-device interconnections are also provided by electricalpathways routed through the RDL 1030 and the RDL 1034. Some embodimentsof this disclosure are directed to improved contact pad-to-RDLinterconnections (e.g., between the trace 1026 a and the contact pad1012 and between the trace 1026 b and the contact pads 1012 and 1018),and further details of such contact pad-to-RDL interconnections areprovided below.

The RDL 1030 is a patterned conductive layer that includes multipletraces, including traces 1030 a, 1030 b, and 1030 c, and at least someof the traces of the RDL 1030 extend into openings 1028 o in thedielectric layer 1028 to electrically connect to the traces of the RDL1026. Some embodiments of this disclosure are directed to improvedRDL-to-RDL interconnections (e.g., between the trace 1026 a and thetrace 1030 a), and further details of such RDL-to-RDL interconnectionsare provided below.

The RDL 1034 is a patterned conductive layer that includes multipletraces, including traces 1034 a and 1034 b, and at least some of thetraces of the RDL 1034 extend into openings 1032 o in the dielectriclayer 1032 to electrically connect to the traces of the RDL 1030. Someembodiments of this disclosure are directed to improved RDL-to-RDLinterconnections (e.g., between the trace 1030 c and the trace 1034 a),and further details of such RDL-to-RDL interconnections are providedbelow. In addition, at least some of the traces of the RDL 1034 extendthrough and are exposed by openings 1036 o in the dielectric layer 1036,and the redistribution stack also includes UBMs 1038 which are disposedover the dielectric layer 1036 and extend into the openings 1036 o inthe dielectric layer 1036 to electrically connect to the traces of theRDL 1034. Some embodiments of this disclosure are directed to improvedRDL-to-UBM interconnections (e.g., between the trace 1034 a and the UBM1038), and further details of such RDL-to-UBM interconnections areprovided below.

The RDLs 1026, 1030, and 1034 can be formed from, or can include,copper, a copper alloy, or another metal, another metal alloy, oranother combination of metals or other conductive materials. The RDLs1026, 1030, and 1034 can be formed from a same conductive material ordifferent conductive materials. While the three RDLs 1026, 1030, and1034 are shown in FIG. 1, it is contemplated that less than three ormore than three RDLs can be included in the semiconductor device package1000 of other embodiments. The dielectric layers 1024, 1028, 1032, and1036 can be formed from, or can include, a dielectric material that ispolymeric or non-polymeric. For example, at least one of the dielectriclayers 1024, 1028, 1032, and 1036 can be formed from polyimide,polybenzoxazole, a benzocyclobutene-based polymer, or a combinationthereof. For certain embodiments, at least one of the dielectric layers1024, 1028, 1032, and 1036 can be formed from a dielectric material thatis photoimageable or photoactive, or from a printable dielectricmaterial. The dielectric layers 1024, 1028, 1032, and 1036 can be formedfrom a same dielectric material or different dielectric materials. Whilethe four dielectric layers 1024, 1028, 1032, and 1036 are shown in FIG.1, it is contemplated that less than four or more than four dielectriclayers can be included in the semiconductor device package 1000 of otherembodiments.

As illustrated, the semiconductor device package 1000 provides atwo-dimensional fan-out configuration in which the RDLs 1026, 1030, and1034 extend laterally beyond lateral peripheries of the electronicdevices 1002 and 1004. For example, the semiconductor device package1000 includes electrical contacts 1040, such as in the form ofconductive bumps, disposed over the UBMs 1038, and at least some of theelectrical contacts 1040 and their corresponding UBMs 1038 are disposedat least partially outside the lateral peripheries of the electronicdevices 1002 and 1004 and adjacent to a lateral periphery of the packagebody 1006. The electrical contacts 1040 allow the semiconductor devicepackage 1000 to be electrically connected to devices external to thesemiconductor device package 1000 through the RDLs 1026, 1030, and 1034.The electrical contacts 1040 can be formed from, or can include, solderor another conductive material.

As noted above, the semiconductor device package 1000 includes highdensity interconnections of traces of the RDL 1026 to the contact pads1012 and 1018 of the electronic devices 1002 and 1004. By way ofcomparison, FIG. 2, FIG. 3, and FIG. 4 show a comparison structure of acontact pad-to-RDL interconnection, where FIG. 2 is a top view, FIG. 3is a cross-sectional view taken along line A-A of FIG. 2, and FIG. 4 isa cross-sectional view taken along line B-B of FIG. 2. As illustrated,traces 2026 a, 2026 b, and 2026 c extend over a dielectric layer 2024which is disposed over an electronic device 2002 including a contact pad2012, and a dielectric layer 2028 is disposed over the traces 2026 a,2026 b, and 2026 c. The trace 2026 a is electrically connected to thecontact pad 2012 through a relatively large via opening 2024 o that isformed in the dielectric layer 2024. Specifically, the trace 2026 aterminates in a via 2090 and a capture pad 2092, where the via 2090extends into the via opening 2024 o, and the capture pad 2092 surroundsthe via 2090. As illustrated, the via 2090 and the capture pad 2092 havedimensions larger than a width of a remaining portion of the trace 2026a, and extend over an entirety of the contact pad 2012 and beyond alateral periphery of the contact pad 2012. Process registrationcapability for forming the comparison structure specify the capture pad2092 to be relatively large to ensure that the trace 2026 a overlaps thecontact pad 2012 and did not miss the contact pad 2012, which wouldresult in an “open” or “near open” connection. Also, material resolutionand concomitant light exposure process capability specify the viaopening 2024 o to be relatively large to form angled sidewalls for areliable electrical connection to the contact pad 2012 and mitigateagainst gaps in sidewall metallization. The relatively large via 2090and the relatively large capture pad 2092 occupy valuable footprintarea, and, since a requisite distance should be maintained between thecapture pad 2092 and the adjacent traces 2026 b and 2026 c for processalignment, the relatively large capture pad 2092 impedes against ahigher density of traces over the electronic device 2002. Asillustrated, the adjacent traces 2026 b and 2026 c are confined to bedisposed outside of the lateral periphery of the contact pad 2012,without extending over the contact pad 2012.

FIG. 5, FIG. 6, and FIG. 7 show a structure of a high density contactpad-to-RDL interconnection included in the semiconductor device package1000 according to some embodiments, where FIG. 5 is a top view, FIG. 6is a cross-sectional view taken along line C-C of FIG. 5, and FIG. 7 isa cross-sectional view taken along line D-D of FIG. 5. As illustrated,the trace 1026 a along with traces 1026 c, 1026 d, 1026 e, 1026 f, and1026 g of the RDL 1026 extend over the dielectric layer 1024 which isdisposed over the electronic device 1002 including the contact pad 1012,and the dielectric layer 1028 is disposed over the traces 1026 a, 1026c, 1026 d, 1026 e, 1026 f, and 1026 g. The opening 1024 o formed in thedielectric layer 1024 exposes a portion of the contact pad 1012, and thetrace 1026 a is electrically connected to the contact pad 1012 throughthe opening 1024 o. The opening 1024 o is relatively small compared todimensions of the contact pad 1012. For example, the contact pad 1012can have dimensions of about 40 μm by about 40 μm, and the opening 1024o can have a maximum length l along a longitudinal direction LD of about8 μm to about 15 μm, about 8 μm to about 12 μm, or about 10 μm, and amaximum width w1 along a transverse direction TD orthogonal to thelongitudinal direction LD of about 2 μm to about 10 μm, about 6 μm toabout 10 μm, or about 8 μm. It should be understood that dimensions ofthe contact pad 1012 and the opening 1024 o can be varied (e.g.,increased or decreased) relative to these stated example values. Themaximum length l of the opening 1024 o can be greater than the maximumwidth w1 of the opening 1024 o. For example, a ratio of the maximumlength l to the maximum width w1 can be about 1.1 or greater, about 1.3or greater, about 1.5 or greater, about 1.8 or greater, about 2 orgreater, or about 3 or greater. The trace 1026 a includes a portion 5002extending over the dielectric layer 1024 along the longitudinaldirection LD adjacent to the opening 1024 o, and a portion 5004 in theopening 1024 o and extending between the portion 5002 and the exposedportion of the contact pad 1012. The portion 5004 of the trace 1026 a inthe opening 1024 o has a maximum width w3 along the transverse directionTD, and the maximum width w3 of the portion 5004 is no greater thanabout 3 times of a width w2 of the remaining portion 5002 of the trace1026 a, such as no greater than about 2.8 times, no greater than about2.5 times, no greater than about 2.3 times, no greater than about 2times, no greater than about 1.8 times, or no greater than about 1.5times of the width w2 of the remaining portion 5002 of trace 1026 a. Insome embodiments, the maximum width w3 of the portion 5004 of the trace1026 a in the opening 1024 o is substantially the same as the width w2of the remaining portion 5002 of trace 1026 a. In some embodiments, thetrace 1026 a has a substantially uniform width along at least a lengthof the trace 1026 a extending over the contact pad 1012. In someembodiments, a projection area of the portion 5004 of the trace 1026 aonto the contact pad 1012 (e.g., an area of about w3×l) is no greaterthan about 10% of a total area of the contact pad 1012, such as nogreater than about 8%, no greater than about 6%, no greater than about4%, or no greater than about 2% of the total area of the contact pad1012. In some embodiments, a total projection area of the trace 1026 aonto the contact pad 1012 (e.g., a sum of the projection area of theportion 5004 and a projection area of the remaining portion 5002) is nogreater than about 15% of the total area of the contact pad 1012, suchas no greater than about 13%, no greater than about 10%, no greater thanabout 8%, or no greater than about 5% of the total area of the contactpad 1012.

Referring to FIG. 5 and FIG. 7, the maximum width w3 of the portion 5004of the trace 1026 a in the opening 1024 o is no greater than or lessthan the maximum width w1 of the opening 1024 o. As illustrated, theportion 5004 of the trace 1026 a is disposed between and spaced fromopposing sidewalls of the dielectric layer 1024 forming the opening 1024o. In some embodiments, the maximum width w3 of the portion 5004 is nogreater than about 9/10, no greater than about ⅘, no greater than about7/10, no greater than about ⅗, no greater than about ½, no greater thanabout ⅖, or no greater than about ⅓ of the maximum width w1 of theopening 1024 o.

As shown in FIG. 6 and FIG. 7, the portion 5004 of the trace 1026 a inthe opening 1024 o is a conformal structure extending into and partiallyfilling the opening 1024 o. In other embodiments, the portion 5004 ofthe trace 1026 a in the opening 1024 o can be a metal-filled structure(e.g., a copper-filled structure) having a thickness in the opening 1024o that is about the same as or greater than a thickness of thedielectric layer 1024, as shown by dashed lines in FIG. 6 and FIG. 7.During manufacturing, the trace 1026 a can be formed by a platingprocess, and the plating process of forming a metal-filled structure canbe similar to that for a conformal structure, with a difference in achemical composition of a plating solution. A further enhancement caninvolve reverse pulse plating, where an applied potential is reversedbriefly during short plating cycles to de-plate any higher points orprotrusions formed during a part of a plating cycle. This results inmore throwing power; namely, openings are plated preferentially asopposed to surface features.

Improved process registration capability as well as improved materialresolution and light exposure process capability allow reliableelectrical connections to be formed at reduced dimensions. Since thetrace 1026 a is electrically connected to the contact pad 1012 whileomitting a relatively large via and a relatively large capture pad, sucha contact pad-to-RDL interconnection conserves valuable footprint area,and promotes a higher density of traces over the electronic device 1002.As illustrated in FIG. 5 and FIG. 7, in addition to the trace 1026 a,the RDL 1026 includes at least two additional traces extending over thedielectric layer 1024 and overlapping the contact pad 1012 disposedbelow the additional traces, such as at least three additional traces,at least four additional traces, or at least five additional traces.Specifically, the traces 1026 c, 1026 d, 1026 e, 1026 f, and 1026 g ofthe RDL 1026 extend over the dielectric layer 1024 and over the contactpad 1012.

To enhance an electrical connection to the contact pad 1012, the trace1026 a can have a varying width, in which the width of the trace 1026 ais greater in a region of the opening 1024 o to ensure aninterconnection, and the width of the trace 1026 a tapers in a directionaway from the opening 1024 o. FIG. 8 shows a top view of a structure ofa high density contact pad-to-RDL interconnection included in thesemiconductor device package 1000 according to some embodiments. Asillustrated, the portion 5004 of the trace 1026 a in the opening 1024 oof the dielectric layer 1024 has the maximum width w3 along thetransverse direction TD, and the maximum width w3 of the portion 5004 isgreater than the width w2 of the remaining portion 5002 of the trace1026 a, such as at least about 1.1 times greater, at least about 1.2times greater, at least about 1.3 times greater, or at least about 1.4times greater. In some embodiments, the maximum width w3 of the portion5004 of the trace 1026 a is greater than the width w2 of the remainingportion 5002 of the trace 1026 a, while remaining no greater than about3 times of the width w2 of the remaining portion 5002 of the trace 1026a, such as no greater than about 2.8 times, no greater than about 2.5times, no greater than about 2.3 times, no greater than about 2 times,no greater than about 1.8 times, or no greater than about 1.5 times ofthe width w2 of the remaining portion 5002 of trace 1026 a.

A further benefit of high density contact pad-to-RDL interconnections isthat a dimensional reduction also can be applied to the contact pads1012 and 1018 of the electronic devices 1002 and 1004. In other words, adimensional reduction of interconnections of traces to the contact pads1012 and 1018 allows dimensions of the contact pads 1012 and 1018themselves to be reduced, resulting in the electronic devices 1002 and1004 having a higher contact pad density. For example, if the contactpads 1012 or 1018 have dimensions of about 40 μm by about 40 μm at apitch between adjacent ones of the contact pads 1012 or 1018 of about 45μm, implementation of high density interconnections can allow dimensionsof the contact pads 1012 or 1018 to be reduced to about 5 μm by about 5μm at a pitch of about 10 μm, thereby increasing linear pad density byabout 4.5 times. With reduced dimensions of the contact pads 1012 or1018, a projection area of traces onto the contact pads 1012 or 1018 canbe increased. For example, and referring to FIG. 5, a projection area ofthe portion 5004 of the trace 1026 a onto the contact pad 1012 ofreduced dimension can be greater than about 10% of the total area of thecontact pad 1012, such as up to about 50%, up to about 40%, up to about30%, or up to about 20% of the total area of the contact pad 1012, and atotal projection area of the trace 1026 a onto the contact pad 1012 canbe greater than about 15% of the total area of the contact pad 1012,such as up to about 60%, up to about 55%, up to about 50%, or up toabout 45% of the total area of the contact pad 1012.

Although the above explanation of a high density contact pad-to-RDLinterconnection has referred to the interconnection between the contactpad 1012 and the trace 1026 a of the semiconductor device package 1000,it should be understood that interconnections between additional tracesof the RDL 1026 and the contact pads 1012 and 1018 of the electronicdevices 1002 and 1004 can be similarly implemented. In addition toconnections of RDLs with contact pads of semiconductor dies, highdensity interconnections also can be applied to connections to passivedevices and other components, such as interposer components (active orpassive, and with or without conductive vias), inserts, and otherembedded devices.

As noted above, the semiconductor device package 1000 includes highdensity interconnections between traces of the RDL 1026 and traces ofthe RDL 1030 and between traces of the RDL 1030 and traces of the RDL1034. By way of comparison, FIG. 9, FIG. 10, and FIG. 11 show acomparison structure of an RDL-to-RDL interconnection, where FIG. 9 is atop view, FIG. 10 is a cross-sectional view taken along line E-E of FIG.9, and FIG. 11 is a cross-sectional view taken along line F-F of FIG. 9.As illustrated, traces 9026 a and 9026 c extend over a dielectric layer9024, a dielectric layer 9028 is disposed over the traces 9026 a and9026 c, traces 9030 a, 9030 d, 9030 e, 9030 f, and 9030 g extend overthe dielectric layer 9028, and a dielectric layer 9032 is disposed overthe traces 9030 a, 9030 d, 9030 e, 9030 f, and 9030 g. The trace 9030 ais electrically connected to the trace 9026 a through a relatively largevia opening 9028 o that is formed in the dielectric layer 9028.Specifically, the trace 9026 a terminates in a capture pad 9094, and thetrace 9030 a terminates in a via 9090 and a capture pad 9092, where thevia 9090 extends into the via opening 9028 o towards the capture pad9094 of the trace 9026 a, and the capture pad 9092 surrounds the via9090. As illustrated, the via 9090 and the capture pads 9092 and 9094have dimensions larger than a width of remaining portions of the traces9026 a and 9030 a. Process registration capability for forming thecomparison structure specify the capture pads 9092 and 9094 to berelatively large to ensure that the trace 9030 a overlaps the trace 9026a and did not miss the trace 9026 a, which would result in an “open” or“near open” connection. Also, material resolution and concomitant lightexposure process capability specify the via opening 9028 o to berelatively large to form angled sidewalls for a reliable electricalconnection to the trace 9026 a and mitigate against gaps in sidewallmetallization. The trace 9030 g is electrically connected to the trace9026 c through a similar interconnection including a capture pad 9096 ofthe trace 9030 g. The relatively large via 9090 and the relatively largecapture pads 9092, 9094, and 9096 occupy valuable footprint area, and,since a requisite distance should be maintained between the capture pads9092 and 9096 and the adjacent traces 9030 d, 9030 e, and 9030 f forprocess alignment, the relatively large capture pads 9092 and 9096impede against a higher density of traces that can extend between thecapture pads 9092 and 9096. Similarly, the relatively large capture pad9094 of the trace 9026 a impedes against a higher density of traces thatcan extend between the capture pad 9094 and an adjacent capture pad ofthe trace 9026 c.

FIG. 12, FIG. 13, FIG. 14, and FIG. 15 show a structure of a highdensity RDL-to-RDL interconnection included in the semiconductor devicepackage 1000 according to some embodiments, where FIG. 12 is a top view,FIG. 13 is a magnified top view of a selected region of FIG. 12 (shownby a dashed box in FIG. 12), FIG. 14 is a cross-sectional view takenalong line G-G of FIG. 13, and FIG. 15 is a cross-sectional view takenalong line H-H of FIG. 13. As illustrated, the trace 1026 a along with atrace 1026 c extend over the dielectric layer 1024, the dielectric layer1028 is disposed over the traces 1026 a and 1026 c, the trace 1030 aalong with traces 1030 d, 1030 e, 1030 f, 1030 g, 1030 h, 1030 i, 1030j, 1030 k, and 1030 l extend over the dielectric layer 1028, and thedielectric layer 1032 is disposed over the traces 1030 a, 1030 d, 1030e, 1030 f, 1030 g, 1030 h, 1030 i, 1030 j, 1030 k, and 1030 l. Theopening 1028 o formed in the dielectric layer 1028 exposes a portion ofthe trace 1026 a, and the trace 1030 a is electrically connected to thetrace 1026 a through the opening 10280. The opening 1028 o is relativelysmall compared to a via opening of a comparison interconnectionstructure. For example, the opening 1028 o can have a maximum length l′along a longitudinal direction LD of about 8 μm to about 15 μm, about 8μm to about 12 μm, or about 10 μm, and a maximum width w4 along atransverse direction TD orthogonal to the longitudinal direction LD ofabout 2 μm to about 10 μm, about 6 μm to about 10 μm, or about 8 μm. Itshould be understood that dimensions of the opening 1028 o can be varied(e.g., increased or decreased) relative to these stated example values.The maximum length l′ of the opening 1028 o can be greater than themaximum width w4 of the opening 10280. For example, a ratio of themaximum length l′ to the maximum width w4 can be about 1.1 or greater,about 1.3 or greater, about 1.5 or greater, about 1.8 or greater, about2 or greater, or about 3 or greater. The trace 1030 a includes a portion1202 extending over the dielectric layer 1028 along the longitudinaldirection LD adjacent to the opening 1028 o, and a portion 1204 in theopening 1028 o and extending between the portion 1202 and the exposedportion of the trace 1026 a. To enhance an electrical connection to thetrace 1026 a, the trace 1030 a can have a varying width, in which thewidth of the trace 1030 a is greater in a region of the opening 1028 oto ensure an interconnection, and the width of the trace 1030 a tapersin a direction away from the opening 10280. As illustrated, the portion1204 of the trace 1030 a in the opening 1028 o has a maximum width w5along the transverse direction TD, the remaining portion 1202 of thetrace 1030 a has a width w6, and the maximum width w5 of the portion1204 is greater than the width w6 of the remaining portion 1202 of thetrace 1030 a, such as at least about 1.1 times greater, at least about1.2 times greater, at least about 1.3 times greater, or at least about1.4 times greater. In some embodiments, the maximum width w5 of theportion 1204 of the trace 1030 a is greater than the width w6 of theremaining portion 1202 of the trace 1030 a, while remaining no greaterthan about 3 times of the width w6 of the remaining portion 1202 of thetrace 1030 a, such as no greater than about 2.8 times, no greater thanabout 2.5 times, no greater than about 2.3 times, no greater than about2 times, no greater than about 1.8 times, or no greater than about 1.5times of the width w6 of the remaining portion 1202 of trace 1030 a.Referring to FIG. 13 and FIG. 15, the portion 1204 of the trace 1030 ain the opening 1028 o covers a top surface and opposing side surfaces ofthe exposed portion of the trace 1026 a in the opening 10280.

The trace 1026 a omits a capture pad, and the trace 1026 a has asubstantially uniform width along at least a length of the exposedportion of the trace 1026 a overlapping the trace 1030 a disposed abovethe trace 1026 a. As illustrated, the trace 1026 a has a width w7, whichis substantially uniform along the length of the trace 1026 a, and issubstantially the same as the width w6 of the remaining portion 1202 ofthe trace 1030 a. To enhance an electrical connection to the trace 1030a, it is also contemplated that the trace 1026 a can have a varyingwidth, in which the width of the trace 1026 a is greater in a region ofthe opening 1028 o to ensure an interconnection, and the width of thetrace 1026 a tapers in a direction away from the opening 10280.

Referring to FIG. 12, FIG. 13, and FIG. 15, the maximum width w5 of theportion 1204 of the trace 1030 a in the opening 1028 o is no greaterthan or less than the maximum width w4 of the opening 10280. Asillustrated, the portion 1204 of the trace 1030 a is disposed betweenand spaced from opposing sidewalls of the dielectric layer 1028 formingthe opening 10280. In some embodiments, the maximum width w5 of theportion 1204 is no greater than about 9/10, no greater than about ⅘, nogreater than about 7/10, no greater than about ⅗, no greater than about½, no greater than about ⅖, or no greater than about ⅓ of the maximumwidth w4 of the opening 10280.

As shown in FIG. 14 and FIG. 15, the portion 1204 of the trace 1030 a inthe opening 1028 o is a conformal structure extending into and partiallyfilling the opening 10280. In other embodiments, the portion 1204 of thetrace 1030 a in the opening 1028 o can be a metal-filled structure(e.g., a copper-filled structure) having a thickness in the opening 1028o that is about the same as or greater than a thickness of thedielectric layer 1028, as shown by dashed lines in FIG. 14 and FIG. 15.

Improved process registration capability as well as improved materialresolution and light exposure process capability allow reliableelectrical connections to be formed at reduced dimensions. Since thetrace 1030 a is electrically connected to the trace 1026 a whileomitting a relatively large via and relatively large capture pads, suchan RDL-to-RDL interconnection conserves valuable footprint area, andpromotes a higher density of traces extending over the dielectric layer1024 and over the dielectric layer 1028. As illustrated in FIG. 12, thetrace 1030 l is electrically connected to the trace 1026 c through asimilar high density interconnection omitting capture pads. In additionto the traces 1030 a and 1030 l, the RDL 1030 includes multipleadditional traces extending over the dielectric layer 1028 and betweenthe interconnection of the trace 1030 a and the trace 1026 a and theinterconnection of the trace 1030 l and the trace 1026 c. Specifically,the traces 1030 d, 1030 e, 1030 f, 1030 g, 1030 h, 1030 i, 1030 j, and1030 k of the RDL 1030 extend over the dielectric layer 1028 and betweenthe interconnections. Similarly, the high density interconnectionspromote a higher density of traces of the RDL 1026 that can extend overthe dielectric layer 1024 and between the interconnections.

Although the trace 1030 a has been explained for some embodiments ashaving a varying width, it is also contemplated that the trace 1030 acan have a substantially uniform width along a length of the trace 1030a. FIG. 16 shows a top view of a structure of a high density RDL-to-RDLinterconnection included in the semiconductor device package 1000according to some embodiments. As illustrated, the portion 1204 of thetrace 1030 a in the opening 1028 o of the dielectric layer 1028 has themaximum width w5 along the transverse direction TD, and the maximumwidth w5 of the portion 1204 is substantially the same as the width w6of the remaining portion 1202 of the trace 1030 a.

Also, although FIG. 16 shows the traces 1026 a and 1030 a assubstantially aligned and of substantially the same width, connectingtraces, in general, can be oriented at varying intersecting angles andcan have different widths as long as a requisite overlapping area ismaintained to promote adequate adhesion and electrical connection. FIG.17 shows a top view of a structure of a high density RDL-to-RDLinterconnection according to some embodiments. As illustrated, the trace1026 a extends along a first direction D1 adjacent to the opening 1028o, and the trace 1030 a extends over the dielectric layer 1028 along asecond direction D2 adjacent to the opening 1028 o, where the seconddirection D2 is substantially perpendicular to the first direction D1.More generally, an intersecting angle of connecting traces can be otherthan substantially parallel or substantially perpendicular. FIG. 18shows a top view of a structure of a high density RDL-to-RDLinterconnection according to some embodiments. As illustrated, the trace1030 a extends over the dielectric layer 1028 along the second directionD2 adjacent to the opening 1028 o, and the trace 1026 a extends alongthe first direction D1 adjacent to the opening 1028 o, where the seconddirection D2 forms an intersecting angle α with respect to the firstdirection D1, and where the intersecting angle α can be in a range of 0°to 360°. In some embodiments, the intersecting angle α is different from0° and different from 180°.

Moreover, although the above explanation of a high density RDL-to-RDLinterconnection has referred to the interconnection between the trace1030 a and the trace 1026 a of the semiconductor device package 1000, itshould be understood that additional interconnections between traces ofthe RDLs 1026, 1030, and 1034 can be similarly implemented. Althoughsome embodiments of RDL-to-RDL interconnections are shown as connectionsbetween two RDLs, it is noted that connections, in general, can beattained between any number of RDLs, such as two or more, three or more,or four or more.

As noted above, the semiconductor device package 1000 includes highdensity interconnections of traces of the RDL 1034 to the UBMs 1038. Byway of comparison, FIG. 19 and FIG. 20 show a comparison structure of anRDL-to-UBM interconnection, where FIG. 19 is a top view, and FIG. 20 isa cross-sectional view taken along line I-I of FIG. 19. As illustrated,traces 19034 a, 19034 b, and 19034 c of an RDL 19034 extend over adielectric layer 19032, a dielectric layer 19036 is disposed over thetraces 19034 a, 19034 b, and 19034 c, and an UBM 19038 is disposed overthe dielectric layer 19036. The UBM 19038 is electrically connected tothe trace 19034 a through a relatively large via opening 19036 o that isformed in the dielectric layer 19036. Specifically, the trace 19034 aterminates in a capture pad 19092, where the via opening 19036 o exposesa portion of the capture pad 19092, and the UBM 19038 extends into thevia opening 19036 o to electrically connect to the capture pad 19092. Asillustrated, the via opening 19036 o and the capture pad 19092 havedimensions larger than a width of a remaining portion of the trace 19034a, and the capture pad 19092 extends beyond a lateral periphery of theUBM 19038 and beyond a projection area of the UBM 19038 onto the RDL10934. Process registration capability for forming the comparisonstructure specify the capture pad 19092 to be relatively large to ensurethat the UBM 19038 overlaps the trace 19034 a and did not miss the trace19034 a, which would result in an “open” or “near open” connection.Also, material resolution and concomitant light exposure processcapability specify the via opening 19036 o to be relatively large toform angled sidewalls for a reliable electrical connection to the trace19034 a and mitigate against gaps in sidewall metallization. Therelatively large via opening 19036 o and the relatively large capturepad 19092 occupy valuable footprint area, and, since a requisitedistance should be maintained between the capture pad 19092 and theadjacent traces 19034 b and 19034 c for process alignment, therelatively large capture pad 19092 impedes against a higher density oftraces extending over the dielectric layer 19032. As illustrated, theadjacent traces 19034 b and 19034 c are confined to be disposed outsideof the lateral periphery of the UBM 19038 and outside of the projectionarea of the UBM 19038 onto the RDL 10934.

FIG. 21, FIG. 22, and FIG. 23 show a structure of a high densityRDL-to-UBM interconnection included in the semiconductor device package1000 according to some embodiments, where FIG. 21 is a top view, FIG. 22is a cross-sectional view taken along line J-J of FIG. 21, and FIG. 23is a cross-sectional view taken along line K-K of FIG. 21. Asillustrated, the trace 1034 a along with traces 1034 c and 1034 d of theRDL 1034 extend over the dielectric layer 1032, a dielectric layer 1036is disposed over the traces 1034 a, 1034 c, and 1034 d, and an UBM 1038is disposed over the dielectric layer 1036. The opening 1036 o formed inthe dielectric layer 1036 exposes a portion of the trace 1034 a, and theUBM 1038 is electrically connected to the trace 1034 a through theopening 1036 o. The opening 1036 o is relatively small compared todimensions of the UBM 1038. For example, the opening 1036 o can have amaximum length l″ along a longitudinal direction LD of about 8 μm toabout 15 μm, about 8 μm to about 12 μm, or about 10 μm, and a maximumwidth w8 along a transverse direction TD orthogonal to the longitudinaldirection LD of about 2 μm to about 10 μm, about 6 μm to about 10 μm, orabout 8 μm. It should be understood that dimensions of the opening 1036o can be varied (e.g., increased or decreased) relative to these statedexample values. The maximum length l″ of the opening 1036 o can begreater than the maximum width w8 of the opening 1036 o. For example, aratio of the maximum length l″ to the maximum width w8 can be about 1.1or greater, about 1.3 or greater, about 1.5 or greater, about 1.8 orgreater, about 2 or greater, or about 3 or greater. The trace 1034 aextends along the longitudinal direction LD adjacent to a projectionarea of the UBM 1038 onto the RDL 1034 and the dielectric layer 1032,and the trace 1034 a includes a portion 21004 that overlaps theprojection area of the UBM 1038 (shown by dashed lines in FIG. 21). TheUBM 1038 has a maximum width w9 along the transverse direction TD, and amaximum width w10 of the overlapping portion 21004 of the trace 1034 ais no greater than about ⅓ of the maximum width w9 of the UBM 1038, suchas no greater than about ¼, no greater than about ⅕, or no greater thanabout ⅙ of the maximum width w9 of the UBM 1038.

The trace 1034 a omits a capture pad, and the trace 1034 a has asubstantially uniform width along at least a length of the overlappingportion 21004 of the trace 1034 a disposed below the UBM 1038. Asillustrated, the maximum width w10 of the overlapping portion 21004 ofthe trace 1034 a is substantially the same as a width w11 of a remainingportion 21002 of the trace 1034 a disposed outside of the projectionarea of the UBM 1038.

Improved process registration capability as well as improved materialresolution and light exposure process capability allow reliableelectrical connections to be formed at reduced dimensions. Since thetrace 1034 a is electrically connected to the UBM 1038 while omitting arelatively large via opening and a relatively large capture pad, such anRDL-to-UBM interconnection conserves valuable footprint area, andpromotes a higher density of traces extending over the dielectric layer1032. As illustrated in FIG. 21 and FIG. 23, in addition to the trace1034 a, the RDL 1034 includes at least two additional traces extendingover the dielectric layer 1032 and extending below the UBM 1038 andwithin the projection area of the UBM 1038, such as at least threeadditional traces, at least four additional traces, or at least fiveadditional traces. Specifically, the traces 1034 c and 1034 d of the RDL1034 extend below the UBM 1038 and within the projection area of the UBM1038.

To enhance an electrical connection to the UBM 1038, the trace 1034 acan have a varying width, in which the width of the trace 1034 a isgreater in a region of the opening 1036 o to ensure an interconnection,and the width of the trace 1034 a tapers in a direction away from theopening 1036 o. FIG. 24 shows a top view of a structure of a highdensity RDL-to-UBM interconnection included in the semiconductor devicepackage 1000 according to some embodiments. As illustrated, theoverlapping portion 21004 of the trace 1034 a in the region of theopening 1036 o has the maximum width w10 along the transverse directionTD, and the maximum width w10 of the overlapping portion 21004 isgreater than the width w11 of the remaining portion 21002 of the trace1034 a, such as at least about 1.1 times greater, at least about 1.2times greater, at least about 1.3 times greater, or at least about 1.4times greater. In some embodiments, the maximum width w10 of theoverlapping portion 21004 of the trace 1034 a is greater than the widthw11 of the remaining portion 21002 of the trace 1034 a, while remainingno greater than about 3 times of the width w11 of the remaining portion21002 of the trace 1034 a, such as no greater than about 2.8 times, nogreater than about 2.5 times, no greater than about 2.3 times, nogreater than about 2 times, no greater than about 1.8 times, or nogreater than about 1.5 times of the width w11 of the remaining portion21002 of trace 1034 a.

Although the above explanation of a high density RDL-to-UBMinterconnection has referred to the interconnection between the trace1034 a and the UBM 1038 of the semiconductor device package 1000, itshould be understood that interconnections between additional traces ofthe RDL 1034 and the UBMs 1038 can be similarly implemented.

Referring back to FIG. 1, at least some high density interconnectionsacross different layers of the semiconductor device package 1000 can besubstantially aligned over one another. For example, an RDL-to-RDLinterconnection can be substantially aligned or stacked over a contactpad-to-RDL interconnection, or one RDL-to-RDL interconnection can besubstantially aligned or stacked over another RDL-to-RDLinterconnection, or an RDL-to-UBM interconnection can be substantiallyaligned or stacked over an RDL-to-RDL interconnection, or a combinationof two or more of such aligned interconnections may be present. Suchalignment of high density interconnections across different layers ofthe semiconductor device package 1000 can allow more efficient routingof signals in a substantially vertical direction, and can provide ahigher overall density of signal routing circuitry within thesemiconductor device package 1000. Such alignment of high densityinterconnections also can allow more efficient delivery of power toeither, or both, of the electronic devices 1002 and 1004. FIG. 1A showsa cross-sectional view of a semiconductor device package 1000′ accordingto some embodiments of this disclosure. The semiconductor device package1000′ is similarly implemented as the semiconductor device package 1000,except that a contact pad-to-RDL interconnection 1080, RDL-to-RDLinterconnections 1082 and 1084, and an RDL-to-UBM interconnection 1086are substantially aligned or stacked over another. Contact pad-to-RDLinterconnections, including the interconnection 1080, and RDL-to-RDLinterconnections, including the interconnections 1082 and 1084, areshown as metal-filled structures, although other implementations asconformal structures are also encompassed by this disclosure.

Attention next turns to FIG. 25, which shows a cross-sectional view of asemiconductor device package 25000 according to some embodiments of thisdisclosure. Certain components of the semiconductor device package 25000and interconnections between the components can be similarly implementedas explained above for the semiconductor device package 1000, andrepetition of detailed explanation is omitted. For example, thesemiconductor device package 25000 also includes a redistribution stackof one or more RDLs 1026, 1030, and 1034 and one or more dielectriclayers 1024, 1028, 1032, and 1036 disposed over active surfaces 1008 and1014 of electronic devices 1002 and 1004 and a front surface 25020 of apackage body 25006. As illustrated, the semiconductor device package25000 provides a two-dimensional fan-out configuration in which the RDLs1026, 1030, and 1034 extend laterally beyond lateral peripheries of theelectronic devices 1002 and 1004. For example, the semiconductor devicepackage 25000 includes electrical contacts 1040, such as in the form ofconductive bumps, disposed over UBMs 1038, and at least some of theelectrical contacts 1040 and their corresponding UBMs 1038 are disposedat least partially outside the lateral peripheries of the electronicdevices 1002 and 1004 and adjacent to a lateral periphery of the packagebody 25006. Interconnections between traces of the RDLs 1026, 1030, and1034 can be implemented as high density interconnections as explained inthe foregoing with reference to FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG.16, FIG. 17, and FIG. 18, and interconnections between traces of the RDL1034 and the UBMs 1038 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.21, FIG. 22, FIG. 23, and FIG. 24.

As illustrated in FIG. 25, the electronic devices 1002 and 1004 aredisposed adjacent to a back surface 25022 of the package body 25006 withtheir back surfaces 1010 and 1016 exposed from the package body 25006,and the semiconductor device package 25000 includes conductive posts25080 disposed over the electronic devices 1002 and 1004 and extendingbetween respective contact pads 1012 and 1018 of the electronic devices1002 and 1004 and the front surface 25020 of the package body 25006. Atleast a portion of a terminal end of each conductive post 25080 isexposed from the front surface 25020 of the package body 25006. Theconductive posts 25080 can be formed from, or can include, copper, acopper alloy, or another metal, another metal alloy, or anothercombination of metals or other conductive materials. The RDL 1026 is apatterned conductive layer that includes multiple traces, includingtraces 1026 a and 1026 b, and at least some of the traces of the RDL1026 extend into openings 1024 o in the dielectric layer 1024 toelectrically connect to the electronic devices 1002 and 1004 through theconductive posts 25080. At least some of the traces of the RDL 1026,such as the trace 1026 b, extend between conductive posts 25080respectively disposed over the electronic devices 1002 and 1004 toprovide device-to-device interconnections, although it is noted thatdevice-to-device interconnections are also provided by electricalpathways routed through the RDL 1030 and the RDL 1034. Some embodimentsof this disclosure are directed to improved conductive post-to-RDLinterconnections (e.g., between the trace 1026 a and the conductive post25080), and further details of such conductive post-to-RDLinterconnections are provided below. At least some high densityinterconnections across different layers of the semiconductor devicepackage 25000 can be substantially aligned over one another to allowmore efficient routing of signals and provide a higher overall densityof signal routing circuitry within the semiconductor device package25000.

FIG. 26, FIG. 27, and FIG. 28 show a structure of a high densityconductive post-to-RDL interconnection included in the semiconductordevice package 25000 according to some embodiments, where FIG. 26 is atop view, FIG. 27 is a cross-sectional view taken along line L-L of FIG.26, and FIG. 28 is a cross-sectional view taken along line M-M of FIG.26. As illustrated, the trace 1026 a along with traces 1026 c, 1026 d,1026 e, 1026 f, and 1026 g of the RDL 1026 extend over the dielectriclayer 1024 which is disposed over the electronic device 1002 includingthe contact pad 1012, the conductive post 25080 extends through thepackage body 25006 and between the contact pad 1012 and the frontsurface 25020 of the package body 25006, and the dielectric layer 1028is disposed over the traces 1026 a, 1026 c, 1026 d, 1026 e, 1026 f, and1026 g. The opening 1024 o formed in the dielectric layer 1024 exposes aportion of the terminal end of the conductive post 25080, and the trace1026 a is electrically connected to the conductive post 25080 throughthe opening 1024 o. The opening 1024 o is relatively small compared todimensions of the conductive post 25080. For example, a lateralperiphery of the conductive post 25080 can be generally circular inshape and can have a diameter of about 40 μm to about 50 μm, and theopening 1024 o can have a maximum length l along a longitudinaldirection LD of about 8 μm to about 15 μm, about 8 μm to about 12 μm, orabout 10 μm, and a maximum width w1 along a transverse direction TDorthogonal to the longitudinal direction LD of about 2 μm to about 10μm, about 6 μm to about 10 μm, or about 8 μm. It should be understoodthat dimensions of the conductive post 25080 and the opening 1024 o canbe varied (e.g., increased or decreased) relative to these statedexample values. The maximum length l of the opening 1024 o can begreater than the maximum width w1 of the opening 1024 o. For example, aratio of the maximum length l to the maximum width w1 can be about 1.1or greater, about 1.3 or greater, about 1.5 or greater, about 1.8 orgreater, about 2 or greater, or about 3 or greater. The trace 1026 aincludes a portion 5002 extending over the dielectric layer 1024 alongthe longitudinal direction LD adjacent to the opening 1024 o, and aportion 5004 in the opening 1024 o and extending between the portion5002 and the exposed portion of the conductive post 25080. The portion5004 of the trace 1026 a in the opening 1024 o has a maximum width w3along the transverse direction TD, and the maximum width w3 of theportion 5004 is no greater than about 3 times of a width w2 of theremaining portion 5002 of the trace 1026 a, such as no greater thanabout 2.8 times, no greater than about 2.5 times, no greater than about2.3 times, no greater than about 2 times, no greater than about 1.8times, or no greater than about 1.5 times of the width w2 of theremaining portion 5002 of trace 1026 a. In some embodiments, the maximumwidth w3 of the portion 5004 of the trace 1026 a in the opening 1024 ois substantially the same as the width w2 of the remaining portion 5002of trace 1026 a. In some embodiments, the trace 1026 a has asubstantially uniform width along at least a length of the trace 1026 aextending over the conductive post 25080. In some embodiments, aprojection area of the portion 5004 of the trace 1026 a onto theterminal end of the conductive post 25080 (e.g., an area of about w3×l)is no greater than about 10% of a total area of the terminal end of theconductive post 25080, such as no greater than about 8%, no greater thanabout 6%, no greater than about 4%, or no greater than about 2% of thetotal area of the terminal end of the conductive post 25080. In someembodiments, a total projection area of the trace 1026 a onto theterminal end of conductive post 25080 (e.g., a sum of the projectionarea of the portion 5004 and a projection area of the remaining portion5002) is no greater than about 15% of the total area of the terminal endof the conductive post 25080, such as no greater than about 13%, nogreater than about 10%, no greater than about 8%, or no greater thanabout 5% of the total area of the terminal end of the conductive post25080.

Referring to FIG. 26 and FIG. 28, the maximum width w3 of the portion5004 of the trace 1026 a in the opening 1024 o is no greater than orless than the maximum width w1 of the opening 1024 o. As illustrated,the portion 5004 of the trace 1026 a is disposed between and spaced fromopposing sidewalls of the dielectric layer 1024 forming the opening 1024o. In some embodiments, the maximum width w3 of the portion 5004 is nogreater than about 9/10, no greater than about ⅘, no greater than about7/10, no greater than about ⅗, no greater than about ½, no greater thanabout ⅖, or no greater than about ⅓ of the maximum width w1 of theopening 1024 o.

As shown in FIG. 27 and FIG. 28, the portion 5004 of the trace 1026 a inthe opening 1024 o is a conformal structure extending into and partiallyfilling the opening 1024 o. In other embodiments, the portion 5004 ofthe trace 1026 a in the opening 1024 o can be a metal-filled structure(e.g., a copper-filled structure) having a thickness in the opening 1024o that is about the same as or greater than a thickness of thedielectric layer 1024, as shown by dashed lines in FIG. 27 and FIG. 28.

Since the trace 1026 a is electrically connected to the conductive post25080 while omitting a relatively large via and a relatively largecapture pad, such a conductive post-to-RDL interconnection conservesvaluable footprint area, and promotes a higher density of traces overthe electronic device 1002. As illustrated in FIG. 26 and FIG. 28, inaddition to the trace 1026 a, the RDL 1026 includes at least twoadditional traces extending over the dielectric layer 1024 andoverlapping the conductive post 25080 disposed below the additionaltraces, such as at least three additional traces, at least fouradditional traces, or at least five additional traces. Specifically, thetraces 1026 c, 1026 d, 1026 e, 1026 f, and 1026 g of the RDL 1026 extendover the dielectric layer 1024 and over the conductive post 25080.

To enhance an electrical connection to the conductive post 25080, thetrace 1026 a can have a varying width, in which the width of the trace1026 a is greater in a region of the opening 1024 o to ensure aninterconnection, and the width of the trace 1026 a tapers in a directionaway from the opening 1024 o. Such a varying width of the trace 1026 acan be similarly implemented as explained in the foregoing withreference to FIG. 8.

A further benefit of high density conductive post-to-RDLinterconnections is that a dimensional reduction also can be applied tothe conductive posts 25080 of the electronic devices 1002 and 1004. Inother words, a dimensional reduction of interconnections of traces tothe conductive posts 25080 allows dimensions of the conductive posts25080 themselves to be reduced. With reduced dimensions of theconductive posts 25080, a projection area of traces onto the conductiveposts 25080 can be increased. For example, and referring to FIG. 26, aprojection area of the portion 5004 of the trace 1026 a onto theterminal end of the conductive post 25080 of reduced dimension can begreater than about 10% of the total area of the terminal end of theconductive post 25080, such as up to about 50%, up to about 40%, up toabout 30%, or up to about 20% of the total area of the terminal end ofthe conductive post 25080, and a total projection area of the trace 1026a onto the terminal end of the conductive post 25080 can be greater thanabout 15% of the total area of the terminal end of the conductive post25080, such as up to about 60%, up to about 55%, up to about 50%, or upto about 45% of the total area of the terminal end of the conductivepost 25080.

Although the above explanation of a high density conductive post-to-RDLinterconnection has referred to the interconnection between the trace1026 a and the conductive post 25080 disposed over the electronic device1002, it should be understood that interconnections between additionaltraces of the RDL 1026 and the conductive posts 25080 disposed over theelectronic devices 1002 and 1004 can be similarly implemented.

Attention next turns to FIG. 29, which shows a cross-sectional view of asemiconductor device package 29000 according to some embodiments of thisdisclosure. Certain components of the semiconductor device package 29000and interconnections between the components can be similarly implementedas explained above for the semiconductor device packages 1000 and 25000,and repetition of detailed explanation is omitted. For example, thesemiconductor device package 29000 also includes a redistribution stackof one or more RDLs 29026, 29030, and 29034 and one or more dielectriclayers 29024, 29028, 29032, and 29036. Interconnections between tracesof the RDLs 29026, 29030, and 29034 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, and FIG. 18.

As illustrated, the semiconductor device package 29000 includeselectronic devices 1002 and 1004, which are disposed over theredistribution stack of the RDLs 29026, 29030, and 29034 and thedielectric layers 29024, 29028, 29032, and 29036, and are electricallyconnected to the redistribution stack by, for example, flip-chipmounting. Specifically, at least some traces of the RDL 29034 extendthrough and are exposed by openings 29036 o in the dielectric layer29036, and the redistribution stack includes UBMs 29038 which aredisposed over the dielectric layer 29036 and extend into the openings29036 o in the dielectric layer 29036 to electrically connect to thetraces of the RDL 29034. The electronic devices 1002 and 1004 aredisposed with their active surfaces 1008 and 1014 adjacent to and facingtowards the UBMs 29038, and the semiconductor device package 29000includes connectors 29082 extending between respective contact pads 1012and 1018 of the electronic devices 1002 and 1004 and respective UBMs29038. The connectors 29082 can be, for example, conductive bumps formedfrom, or including, solder or another conductive material, or conductiveposts formed from, or including, copper, a copper alloy, or anothermetal, another metal alloy, or another combination of metals or otherconductive materials. The semiconductor device package 29000 alsoincludes a package body 29006 that covers or encapsulates the electronicdevices 1002 and 1004, and is disposed over the redistribution stack ofthe RDLs 29026, 29030, and 29034 and the dielectric layers 29024, 29028,29032, and 29036. Interconnections between traces of the RDL 29034 andthe UBMs 29038 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 21, FIG. 22, FIG. 23,and FIG. 24.

As illustrated, the semiconductor device package 29000 provides atwo-dimensional fan-out configuration in which the RDLs 29026, 29030,and 29034 extend laterally beyond lateral peripheries of the electronicdevices 1002 and 1004. The RDL 29026 is a patterned conductive layerthat includes multiple traces, including traces 29026 a and 29026 b, andat least some of the traces of the RDL 29026 extend into openings 29024o in the dielectric layer 29024 to electrically connect to conductivepads 29084 that are at least partially embedded in the dielectric layer29024. The semiconductor device package 29000 includes electricalcontacts 1040, such as in the form of conductive bumps, disposed overthe conductive pads 29084, and at least some of the electrical contacts1040 and their corresponding conductive pads 29084 are disposed at leastpartially outside the lateral peripheries of the electronic devices 1002and 1004 and adjacent to a lateral periphery of the semiconductor devicepackage 29000. Some embodiments of this disclosure are directed toimproved conductive pad-to-RDL interconnections (e.g., between the trace29026 a and the conductive pad 29084), and further details of suchconductive pad-to-RDL interconnections are provided below. At least somehigh density interconnections across different layers of thesemiconductor device package 29000 can be substantially aligned over oneanother to allow more efficient routing of signals and provide a higheroverall density of signal routing circuitry within the semiconductordevice package 29000.

FIG. 30, FIG. 31, and FIG. 32 show a structure of a high densityconductive pad-to-RDL interconnection included in the semiconductordevice package 29000 according to some embodiments, where FIG. 30 is atop view, FIG. 31 is a cross-sectional view taken along line N-N of FIG.30, and FIG. 32 is a cross-sectional view taken along line O-O of FIG.30. As illustrated, the trace 29026 a along with traces 29026 c, 29026d, 29026 e, 29026 f, and 29026 g of the RDL 29026 extend over thedielectric layer 29024 which is disposed over the conductive pad 29084,and the dielectric layer 29028 is disposed over the traces 29026 a,29026 c, 29026 d, 29026 e, 29026 f, and 29026 g. The opening 29024 oformed in the dielectric layer 29024 exposes a portion of the conductivepad 29084, and the trace 29026 a is electrically connected to theconductive pad 29084 through the opening 29024 o. The opening 29024 o isrelatively small compared to dimensions of the conductive pad 29084. Forexample, a lateral periphery of the conductive pad 29084 can begenerally circular in shape and can have a diameter of about 50 μm toabout 150 μm, and the opening 29024 o can have a maximum length l′″along a longitudinal direction LD of about 8 μm to about 15 μm, about 8μm to about 12 μm, or about 10 μm, and a maximum width w12 along atransverse direction TD orthogonal to the longitudinal direction LD ofabout 2 μm to about 10 μm, about 6 μm to about 10 μm, or about 8 μm. Itshould be understood that dimensions of the conductive pad 29084 and theopening 29024 o can be varied (e.g., increased or decreased) relative tothese stated example values. The maximum length l′″ of the opening 29024o can be greater than the maximum width w12 of the opening 29024 o. Forexample, a ratio of the maximum length l′″ to the maximum width w12 canbe about 1.1 or greater, about 1.3 or greater, about 1.5 or greater,about 1.8 or greater, about 2 or greater, or about 3 or greater. Thetrace 29026 a includes a portion 29002 extending over the dielectriclayer 29024 along the longitudinal direction LD adjacent to the opening29024 o, and a portion 29004 in the opening 29024 o and extendingbetween the portion 29002 and the exposed portion of the conductive pad29084. The portion 29004 of the trace 29026 a in the opening 29024 o hasa maximum width w13 along the transverse direction TD, and the maximumwidth w13 of the portion 29004 is no greater than about 3 times of awidth w14 of the remaining portion 29002 of the trace 29026 a, such asno greater than about 2.8 times, no greater than about 2.5 times, nogreater than about 2.3 times, no greater than about 2 times, no greaterthan about 1.8 times, or no greater than about 1.5 times of the widthw14 of the remaining portion 29002 of trace 29026 a. In someembodiments, the maximum width w13 of the portion 29004 of the trace29026 a in the opening 29024 o is substantially the same as the widthw14 of the remaining portion 29002 of trace 29026 a. In someembodiments, the trace 29026 a has a substantially uniform width alongat least a length of the trace 29026 a extending over the conductive pad29084. In some embodiments, a projection area of the portion 29004 ofthe trace 29026 a onto the conductive pad 29084 (e.g., an area of aboutw13×l″′) is no greater than about 10% of a total area of the conductivepad 29084, such as no greater than about 8%, no greater than about 6%,no greater than about 4%, or no greater than about 2% of the total areaof the conductive pad 29084. In some embodiments, a total projectionarea of the trace 29026 a onto the conductive pad 29084 (e.g., a sum ofthe projection area of the portion 29004 and a projection area of theremaining portion 29002) is no greater than about 15% of the total areaof the conductive pad 29084, such as no greater than about 13%, nogreater than about 10%, no greater than about 8%, or no greater thanabout 5% of the total area of the conductive pad 29084.

Referring to FIG. 30 and FIG. 32, the maximum width w13 of the portion29004 of the trace 29026 a in the opening 29024 o is no greater than orless than the maximum width w12 of the opening 29024 o. As illustrated,the portion 29004 of the trace 29026 a is disposed between and spacedfrom opposing sidewalls of the dielectric layer 29024 forming theopening 29024 o. In some embodiments, the maximum width w13 of theportion 29004 is no greater than about 9/10, no greater than about ⅘, nogreater than about 7/10, no greater than about ⅗, no greater than about½, no greater than about ⅖, or no greater than about ⅓ of the maximumwidth w12 of the opening 29024 o.

As shown in FIG. 31 and FIG. 32, the portion 29004 of the trace 29026 ain the opening 29024 o is a conformal structure extending into andpartially filling the opening 29024 o. In other embodiments, the portion29004 of the trace 29026 a in the opening 29024 o can be a metal-filledstructure (e.g., a copper-filled structure) having a thickness in theopening 29024 o such that its top surface is about a same level as, orprotrudes beyond, a top surface of the dielectric layer 29024, as shownby dashed lines in FIG. 31 and FIG. 32.

Since the trace 29026 a is electrically connected to the conductive pad29084 while omitting a relatively large via and a relatively largecapture pad, such a conductive pad-to-RDL interconnection conservesvaluable footprint area, and promotes a higher density of traces overthe conductive pad 29084. As illustrated in FIG. 30 and FIG. 32, inaddition to the trace 29026 a, the RDL 29026 includes at least twoadditional traces extending over the dielectric layer 29024 andoverlapping the conductive pad 29084 disposed below the additionaltraces, such as at least three additional traces, at least fouradditional traces, or at least five additional traces. Specifically, thetraces 29026 c, 29026 d, 29026 e, 29026 f, and 29026 g of the RDL 29026extend over the dielectric layer 29024 and over the conductive pad29084.

To enhance an electrical connection to the conductive pad 29084, thetrace 29026 a can have a varying width, in which the width of the trace29026 a is greater in a region of the opening 29024 o to ensure aninterconnection, and the width of the trace 29026 a tapers in adirection away from the opening 29024 o. Such a varying width of thetrace 29026 a can be similarly implemented as explained in the foregoingwith reference to FIG. 8.

A further benefit of high density conductive pad-to-RDL interconnectionsis that a dimensional reduction also can be applied to the conductivepads 29084. In other words, a dimensional reduction of interconnectionsof traces to the conductive pads 29084 allows dimensions of theconductive pads 29084 themselves to be reduced. With reduced dimensionsof the conductive pads 29084, a projection area of traces onto theconductive pads 29084 can be increased. For example, and referring toFIG. 30, a projection area of the portion 29004 of the trace 29026 aonto the conductive pad 29084 of reduced dimension can be greater thanabout 10% of the total area of the conductive pad 29084, such as up toabout 50%, up to about 40%, up to about 30%, or up to about 20% of thetotal area of the conductive pad 29084, and a total projection area ofthe trace 29026 a onto the conductive pad 29084 can be greater thanabout 15% of the total area of the conductive pad 29084, such as up toabout 60%, up to about 55%, up to about 50%, or up to about 45% of thetotal area of the conductive pad 29084.

Although the above explanation of a high density conductive pad-to-RDLinterconnection has referred to the interconnection between the trace29026 a and the conductive pad 29084, it should be understood thatinterconnections between additional traces of the RDL 29026 andadditional conductive pads 29084 can be similarly implemented.

Additional embodiments of this disclosure are directed to high densityinterconnections in three-dimensional semiconductor device packages,such as for stacked package assemblies or package-on-package (PoP)assemblies. In some embodiments, a stacked package assembly includes asemiconductor device package and an electronic component disposed overand electrically connected to the semiconductor device package. Withinthe semiconductor device package, high density interconnections usingRDLs provide a high density of signal, power, and ground tracesconnecting electronic devices within the package as well as a highdensity of traces providing connections external to the package,including connections to the electronic component disposed over thepackage. For example, the RDLs provide a high density ofdevice-to-device interconnections (e.g., die-to-die or die-to-passivedevice interconnections). In some embodiments, high densityinterconnections are attained through one or more of the followinginterconnection structures: contact pad-to-RDL interconnections;RDL-to-RDL interconnections; RDL-to-UBM interconnections; conductivepost-to-RDL interconnections; conductive pad-to-RDL interconnections;and conductive via-to-RDL interconnections. In some embodiments, highdensity interconnections are attained through traces extending into orthrough dielectric openings with capture pads omitted.

Referring to FIG. 33, a cross-sectional view is shown of a stackedpackage assembly 33000 according to some embodiments of this disclosure.The stacked package assembly 33000 includes a semiconductor devicepackage 33050 and an electronic component 33052 disposed over thesemiconductor device package 33050. The electronic component 33052 iselectrically connected to the semiconductor device package 33050 throughconnectors 33054, which can be, for example, conductive bumps formedfrom, or including, solder or another conductive material, or conductiveposts formed from, or including, copper, a copper alloy, or anothermetal, another metal alloy, or another combination of metals or otherconductive materials. The electronic component 33052 can be an activedevice, a passive device, or a combination thereof. For example, theelectronic component 33052 can be, or can include, a memory die. It isalso contemplated that the electronic component 33052 can be asemiconductor device package. Although FIG. 33 shows the electroniccomponent 33052 as extending over the semiconductor device package 33050in a bridging configuration through the connectors 33054, such abridging configuration can be omitted in other embodiments, such as byincluding multiple electronic components laterally adjacent to oneanother and disposed over respective regions of the semiconductor devicepackage 33050. Further, multiple electronic components can be stackedover one another and over the semiconductor device package 33050.

The semiconductor device package 33050 includes an electronic device1002, which is an active device corresponding to a semiconductor die orchip, although it is contemplated that the electronic device 1002, ingeneral, can be any active device, any passive device, or a combinationthereof. The electronic device 1002 includes an active surface 1008, aback surface 1010 opposite to the active surface 1008, and contact pads1012 adjacent to the active surface 1008. The contact pads 1012 provideinput and output electrical connections for an integrated circuit withinthe electronic device 1002.

As shown in FIG. 33, the semiconductor device package 33050 alsoincludes a package body 33006 that covers or encapsulates portions ofthe electronic device 1002. The package body 33006 can providemechanical stability as well as protection against oxidation, humidity,and other environmental conditions. Referring to FIG. 33, the packagebody 33006 covers the back surface 1010 and lateral sides of theelectronic device 1002, with its active surface 1008 at least partiallyexposed from or uncovered by the package body 33006. The package body33006 includes a front surface 33020 and a back surface 33022 oppositeto the front surface 33020. The package body 33006 can be formed from,or can include, a molding material. The molding material can include,for example, a Novolac-based resin, an epoxy-based resin, asilicone-based resin, or another suitable encapsulant. Suitable fillerscan also be included, such as powdered silica. The molding material canbe a pre-impregnated material, such as a pre-impregnated dielectricmaterial.

The semiconductor device package 33050 also includes interposercomponents or inserts 33070. As illustrated, the interposer components33070 are discrete components disposed adjacent to and at leastpartially surrounding the lateral sides of the electronic device 1002,as shown in FIG. 34. It is also contemplated that a contiguousinterposer component that extends at least partially around the lateralsides of the electronic device 1002 can be included. Referring to FIG.33, each interposer component 33070 includes a substrate that can beformed of, or can include, glass, silicon, a metal, a metal alloy, apolymer, or another suitable structural material. The interposercomponents 33070 in the semiconductor device package 33050 can be formedfrom a same structural material or from different structural materials.Each interposer component 33070 also includes conductive vias 33072extending from a lower surface 33074 of the interposer component 33070to an upper surface 33076 of the interposer component 33070. Asillustrated, terminal ends of the conductive vias 33072 adjacent to thelower surface 33074 of the interposer component 33070 are at leastpartially exposed from the front surface 33020 of the package body33006, and terminal ends of the conductive vias 33072 adjacent to theupper surface 33076 of the interposer component 33070 are at leastpartially exposed from the back surface 33022 of the package body 33006.The conductive vias 33072 can be formed from, or can include, a metal, ametal alloy, a conductive paste, or other conductive material orcombination of conductive materials. The conductive vias 33072 in thesemiconductor device package 33050 can be formed from a same conductivematerial or from different conductive materials. In some embodiments, alateral periphery of each conductive via 33072 can be generally circularin shape and can have a diameter in a range from about 10 μm to about 50μm, from about 10 μm to about 20 μm, or from about 20 μm to about 50 μm.

The semiconductor device package 33050 also includes a redistributionstack of one or more RDLs and one or more dielectric layers disposedover the active surface 1008 of the electronic device 1002, the lowersurfaces 33074 of the interposer components 33070, and the front surface33020 of the package body 33006. As illustrated, a dielectric layer33024 is disposed over the electronic device 1002 and the package body33006, an RDL 33026 is disposed over the dielectric layer 33024, adielectric layer 33028 is disposed over the RDL 33026, an RDL 33030 isdisposed over the dielectric layer 33028 and is electrically connectedto the RDL 33026 through the dielectric layer 33028, a dielectric layer33032 is disposed over the RDL 33030, an RDL 33034 is disposed over thedielectric layer 33032 and is electrically connected to the RDL 33030through the dielectric layer 33032, a dielectric layer 33036 is disposedover the RDL 33034, and UBMs 33038 are disposed over the dielectriclayer 33036 and are electrically connected to the RDL 33034 through thedielectric layer 33036. Certain components of the redistribution stackof the RDLs 33026, 33030, and 33034 and the dielectric layers 33024,33028, 33032, and 33036 can be similarly implemented as explained abovefor the semiconductor device packages 1000, 25000, and 29000, andrepetition of detailed explanation is omitted. Interconnections betweentraces of the RDL 33026 and the contact pads 1012 of the electronicdevice 1002 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 5, FIG. 6, FIG. 7, andFIG. 8, interconnections between traces of the RDLs 33026, 33030, and33034 can be implemented as high density interconnections as explainedin the foregoing with reference to FIG. 12, FIG. 13, FIG. 14, FIG. 15,FIG. 16, FIG. 17, and FIG. 18, and interconnections between traces ofthe RDL 33034 and the UBMs 33038 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.21, FIG. 22, FIG. 23, and FIG. 24.

Referring to FIG. 33, the RDL 33026 includes multiple traces, includingtraces 33026 a and 33026 b, and at some of the traces of the RDL 33026extend into openings 33024 o in the dielectric layer 33024 toelectrically connect to the conductive vias 33072 of the interposercomponents 33070. At least some of the traces of the RDL 33026, such asthe trace 33026 b, extend between the contact pads 1012 of theelectronic device 1002 and the conductive vias 33072 of the interposercomponents 33070 to provide device-to-interposer interconnections,although it is noted that device-to-interposer interconnections are alsoprovided by electrical pathways routed through the RDL 33030 and the RDL33034. Some embodiments of this disclosure are directed to improvedconductive via-to-RDL interconnections (e.g., between the trace 33026 aand the contact via 33072 and between the trace 33026 b and theconductive via 33072), and further details of such conductive via-to-RDLinterconnections are provided below. At least some high densityinterconnections across different layers of the semiconductor devicepackage 33050 can be substantially aligned over one another to allowmore efficient routing of signals and provide a higher overall densityof signal routing circuitry within the semiconductor device package33050.

The conductive vias 33072 in the interposer components 33070 extend atwo-dimensional fan-out configuration to a three-dimensional fan-outconfiguration by providing electrical pathways from the electronicdevice 1002 to the electronic component 33052 through the connectors33054. As illustrated, the connectors 33054 extend between theelectronic component 33052 and the conductive vias 33072, and at leastsome of the connectors 33054 are disposed at least partially outside alateral periphery of the electronic device 1002 and adjacent to alateral periphery of the semiconductor device package 33050. It is notedthat the connectors 33054, in general, can be laterally disposed withinthe lateral periphery of the electronic device 1002, outside of thatperiphery, or both, such that the semiconductor device package 33050 canhave a three-dimensional fan-out configuration, a three-dimensionalfan-in configuration, or a combination of a three-dimensional fan-outand a fan-in configuration.

Although the cross-sectional view of FIG. 33 shows the one electronicdevice 1002 in the semiconductor device package 33050, multipleelectronic devices can be included in the semiconductor device package33050. FIG. 34 is a top cross-sectional view of the semiconductor devicepackage 33050 taken along a plane P-P of FIG. 33, according to someembodiments of this disclosure. The cross-sectional view shows multipleelectronic devices, including the electronic device 1002 and anadditional electronic device 1004, and also shows the interposercomponents 33070 as discrete components surrounding the electronicdevices 1002 and 1004 and encapsulated in the package body 33006.

FIG. 35 shows a top view of a structure of a high density conductivevia-to-RDL interconnection included in the semiconductor device package33050 according to some embodiments. As illustrated, the trace 33026 aalong with traces 33026 c and 33026 d of the RDL 33026 extend over thedielectric layer 33024 which is disposed over the conductive via 33072.The opening 33024 o formed in the dielectric layer 33024 exposes aportion of a terminal end of the conductive via 33072, and the trace33026 a is electrically connected to the conductive via 33072 throughthe opening 33024 o. For example, a lateral periphery of the conductivevia 33072 can be generally circular in shape and can have a diameter ofabout 10 μm to about 50 μm, and the opening 33024 o can have a maximumlength l″″ along a longitudinal direction LD of about 8 μm to about 15μm, about 8 μm to about 12 μm, or about 10 μm, and a maximum width w15along a transverse direction TD orthogonal to the longitudinal directionLD of about 2 μm to about 10 μm, about 6 μm to about 10 μm, or about 8μm. It should be understood that dimensions of the conductive via 33072and the opening 33024 o can be varied (e.g., increased or decreased)relative to these stated example values. The maximum length l″″ of theopening 33024 o can be greater than the maximum width w15 of the opening33024 o. For example, a ratio of the maximum length l″″ to the maximumwidth w15 can be about 1.1 or greater, about 1.3 or greater, about 1.5or greater, about 1.8 or greater, about 2 or greater, or about 3 orgreater. The trace 33026 a includes a portion 35002 extending over thedielectric layer 33024 along the longitudinal direction LD adjacent tothe opening 33024 o, and a portion 35004 in the opening 33024 o andextending between the portion 35002 and the exposed portion of theconductive via 33072. The portion 35004 of the trace 33026 a in theopening 33024 o has a maximum width w16 along the transverse directionTD, and the maximum width w16 of the portion 35004 is no greater thanabout 3 times of a width w17 of the remaining portion 35002 of the trace33026 a, such as no greater than about 2.8 times, no greater than about2.5 times, no greater than about 2.3 times, no greater than about 2times, no greater than about 1.8 times, or no greater than about 1.5times of the width w17 of the remaining portion 35002 of trace 33026 a.In some embodiments, the maximum width w16 of the portion 35004 of thetrace 33026 a in the opening 33024 o is substantially the same as thewidth w17 of the remaining portion 35002 of trace 33026 a. In someembodiments, the trace 33026 a has a substantially uniform width alongat least a length of the trace 33026 a extending over the conductive via33072. In some embodiments, a projection area of the portion 35004 ofthe trace 33026 a onto the terminal end of the conductive via 33072(e.g., an area of about w16×l″″) is no greater than about 40% of a totalarea of the terminal end of the conductive via 33072, such as no greaterthan about 35%, no greater than about 30%, no greater than about 25%, orno greater than about 20% of the total area of the terminal end of theconductive via 33072.

Referring to FIG. 35, the maximum width w16 of the portion 35004 of thetrace 33026 a in the opening 33024 o is no greater than or less than themaximum width w15 of the opening 33024 o. As illustrated, the portion35004 of the trace 33026 a is disposed between and spaced from opposingsidewalls of the dielectric layer 33024 forming the opening 33024 o. Insome embodiments, the maximum width w16 of the portion 35004 is nogreater than about 9/10, no greater than about ⅘, no greater than about7/10, no greater than about ⅗, no greater than about ½, no greater thanabout ⅖, or no greater than about ⅓ of the maximum width w15 of theopening 33024 o.

Since the trace 33026 a is electrically connected to the conductive via33072 while omitting a relatively large via and a relatively largecapture pad, such a conductive via-to-RDL interconnection conservesvaluable footprint area, and promotes a higher density of traces overthe conductive via 33072. As illustrated in FIG. 35, in addition to thetrace 33026 a, the RDL 33026 includes at least one additional traceextending over the dielectric layer 33024 and overlapping the conductivevia 33072 disposed below the additional trace, such as at least twoadditional traces, at least three additional traces, or at least fouradditional traces. Specifically, the traces 33026 c and 33026 d of theRDL 33026 extend over the dielectric layer 33024 and over the conductivevia 33072.

To enhance an electrical connection to the conductive via 33072, thetrace 33026 a can have a varying width, in which the width of the trace33026 a is greater in a region of the opening 33024 o to ensure aninterconnection, and the width of the trace 33026 a tapers in adirection away from the opening 33024 o. Such a varying width of thetrace 33026 a can be similarly implemented as explained in the foregoingwith reference to FIG. 8.

A further benefit of high density conductive via-to-RDL interconnectionsis that a dimensional reduction also can be applied to the conductivevias 33072 of the interposer components 33070. In other words, adimensional reduction of interconnections of traces to the conductivevias 33072 allows dimensions of the conductive vias 33072 themselves tobe reduced. With reduced dimensions of the conductive vias 33072, aprojection area of traces onto the conductive vias 33072 can beincreased. For example, and referring to FIG. 35, a projection area ofthe portion 35004 of the trace 33026 a onto the terminal end of theconductive via 33072 of reduced dimension can be greater than about 40%of the total area of the terminal end of the conductive via 33072, suchas up to about 65%, up to about 60%, up to about 55%, or up to about 50%of the total area of the terminal end of the conductive via 33072.

Although the above explanation of a high density conductive via-to-RDLinterconnection has referred to the interconnection between the trace33026 a and the conductive via 33072, it should be understood thatinterconnections between additional traces of the RDL 33026 andadditional conductive vias 33072 can be similarly implemented.

Attention next turns to FIG. 36, which shows a cross-sectional view of astacked package assembly 36000 according to some embodiments of thisdisclosure. The stacked package assembly 36000 includes a semiconductordevice package 36050 and an electronic component 33052 disposed over thesemiconductor device package 36050 and electrically connected to thesemiconductor device package 36050 through connectors 33054. Certaincomponents of the stacked package assembly 36000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assembly 33000, and repetition of detailedexplanation is omitted. For example, the semiconductor device package36050 also includes a redistribution stack of one or more RDLs 33026,33030, and 33034 and one or more dielectric layers 33024, 33028, 33032,and 33036 disposed over an active surface 1008 of an electronic device1002, lower surfaces 33074 of interposer components 33070, and a frontsurface 36020 of a package body 36006, and UBMs 33038 are disposed overthe dielectric layer 33036 and are electrically connected to the RDL33034 through the dielectric layer 33036. Interconnections betweentraces of the RDLs 33026, 33030, and 33034 can be implemented as highdensity interconnections as explained in the foregoing with reference toFIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, and FIG. 18, andinterconnections between traces of the RDL 33034 and the UBMs 33038 canbe implemented as high density interconnections as explained in theforegoing with reference to FIG. 21, FIG. 22, FIG. 23, and FIG. 24.

As illustrated, the electronic device 1002 and the interposer components33070 are disposed adjacent to a back surface 36022 of the package body36006 with their back surface 1010 and upper surfaces 33076 exposed fromthe package body 36006, and the semiconductor device package 36050includes conductive posts 36080 a disposed over the electronic device1002 and extending between respective contact pads 1012 of theelectronic device 1002 and the front surface 36020 of the package body36006, as well as conductive posts 36080 b disposed over the interposercomponents 33070 and extending between respective conductive vias 33072of the interposer components 33070 and the front surface 36020 of thepackage body 36006. At least a portion of a terminal end of eachconductive post 36080 a or 36080 b is exposed from the front surface36020 of the package body 36006. The conductive posts 36080 a and 36080b can be formed from, or can include, copper, a copper alloy, or anothermetal, another metal alloy, or another combination of metals or otherconductive materials. The RDL 33026 is a patterned conductive layer thatincludes multiple traces, including traces 33026 a and 33026 b, and atsome of the traces of the RDL 33026 extend into openings 33024 o in thedielectric layer 33024 to electrically connect to the electronic device1002 and interposer components 33070 through the conductive posts 36080a and 36080 b. Interconnections between traces of the RDL 33026 and theconductive posts 36080 a and 36080 b can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.26, FIG. 27, and FIG. 28. At least some high density interconnectionsacross different layers of the semiconductor device package 36050 can besubstantially aligned over one another to allow more efficient routingof signals and provide a higher overall density of signal routingcircuitry within the semiconductor device package 36050.

Although the cross-sectional view of FIG. 36 shows the one electronicdevice 1002 in the semiconductor device package 36050, multipleelectronic devices can be included in the semiconductor device package36050. FIG. 37 is a top cross-sectional view of the semiconductor devicepackage 36050 taken along a plane Q-Q of FIG. 36, according to someembodiments of this disclosure. The cross-sectional view shows multipleelectronic devices, including the electronic device 1002 and anadditional electronic device 1004, and also shows the interposercomponents 33070 as discrete components surrounding the electronicdevices 1002 and 1004 and encapsulated in the package body 36006.

Attention next turns to FIG. 38, which shows a cross-sectional view of astacked package assembly 38000 according to some embodiments of thisdisclosure. The stacked package assembly 38000 includes a semiconductordevice package 38050 and an electronic component 33052 disposed over thesemiconductor device package 38050 and electrically connected to thesemiconductor device package 38050 through connectors 33054. Certaincomponents of the stacked package assembly 38000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assemblies 33000 and 36000, and repetition ofdetailed explanation is omitted. For example, the semiconductor devicepackage 38050 also includes a redistribution stack of one or more RDLs33026, 33030, and 33034 and one or more dielectric layers 33024, 33028,33032, and 33036 disposed over an active surface 1008 of an electronicdevice 1002 and a front surface 38020 of a package body 38006, and UBMs33038 are disposed over the dielectric layer 33036 and are electricallyconnected to the RDL 33034 through the dielectric layer 33036.Conductive posts 36080 a are disposed over the electronic device 1002and extend between respective contact pads 1012 of the electronic device1002 and the front surface 38020 of the package body 38006.Interconnections between traces of the RDLs 33026, 33030, and 33034 canbe implemented as high density interconnections as explained in theforegoing with reference to FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16,FIG. 17, and FIG. 18, interconnections between traces of the RDL 33034and the UBMs 33038 can be implemented as high density interconnectionsas explained in the foregoing with reference to FIG. 21, FIG. 22, FIG.23, and FIG. 24, and interconnections between traces of the RDL 33026and the conductive posts 36080 a can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.26, FIG. 27, and FIG. 28.

As illustrated in FIG. 38 and in place of interposer components, thesemiconductor device package 38050 includes conductive posts 38080extending between the front surface 38020 of the package body 38006 anda back surface 38022 of the package body 38006. At least a portion of aterminal end of each conductive post 38080 is exposed from the frontsurface 38020 of the package body 38006, and at least a portion of anopposite terminal end of each conductive post 38080 is exposed from theback surface 38022 of the package body 38006 and is electricallyconnected to the electronic component 33052 through a respectiveconnector 33054. A lateral periphery of each conductive post 38080 canbe generally circular in shape and can have a diameter of about 50 μm toabout 100 μm. The conductive posts 38080 can be formed from, or caninclude, copper, a copper alloy, or another metal, another metal alloy,or another combination of metals or other conductive materials. The RDL33026 is a patterned conductive layer that includes multiple traces, andat some of the traces of the RDL 33026 extend into openings 33024 o inthe dielectric layer 33024 to electrically connect to the conductiveposts 38080. Interconnections between traces of the RDL 33026 and theconductive posts 38080 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.26, FIG. 27, and FIG. 28. At least some high density interconnectionsacross different layers of the semiconductor device package 38050 can besubstantially aligned over one another to allow more efficient routingof signals and provide a higher overall density of signal routingcircuitry within the semiconductor device package 38050.

Although the cross-sectional view of FIG. 38 shows the one electronicdevice 1002 in the semiconductor device package 38050, multipleelectronic devices can be included in the semiconductor device package38050. FIG. 39 is a top cross-sectional view of the semiconductor devicepackage 38050 taken along a plane R-R of FIG. 38, according to someembodiments of this disclosure. The cross-sectional view shows multipleelectronic devices, including the electronic device 1002 and anadditional electronic device 1004, and also shows the conductive posts38080 surrounding the electronic devices 1002 and 1004 and encapsulatedin the package body 38006.

Attention next turns to FIG. 40, which shows a cross-sectional view of astacked package assembly 40000 according to some embodiments of thisdisclosure. The stacked package assembly 40000 includes a semiconductordevice package 40050 and an electronic component 33052 disposed over thesemiconductor device package 40050 and electrically connected to thesemiconductor device package 40050 through connectors 33054. Certaincomponents of the stacked package assembly 40000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assemblies 33000, 36000, and 38000, andrepetition of detailed explanation is omitted. For example, thesemiconductor device package 40050 also includes a redistribution stackof one or more RDLs 40026, 40030, and 40034 and one or more dielectriclayers 40024, 40028, 40032, and 40036. Interconnections between tracesof the RDLs 40026, 40030, and 40034 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, and FIG. 18.

As illustrated in FIG. 40, the semiconductor device package 40050includes an electronic device 1002 and interposer components 33070,which are disposed over the redistribution stack of the RDLs 40026,40030, and 40034 and the dielectric layers 40024, 40028, 40032, and40036, and are electrically connected to the redistribution stack by,for example, flip-chip mounting. Specifically, the redistribution stackincludes UBMs 40038 which are disposed over the dielectric layer 40036and extend into openings 40036 o in the dielectric layer 40036 toelectrically connect to traces of the RDL 40034. The electronic device1002 and the interposer components 33070 are disposed with their activesurface 1008 and lower surfaces 33074 adjacent to and facing towards theUBMs 40038, and the semiconductor device package 40050 includesconnectors 40082 a extending between respective contact pads 1012 of theelectronic device 1002 and respective UBMs 40038, as well as connectors40082 b extending between respective conductive vias 33072 of theinterposer components 33070 and respective UBMs 40038. The connectors40082 a and 40082 b can be, for example, conductive bumps formed from,or including, solder or another conductive material, or conductive postsformed from, or including, copper, a copper alloy, or another metal,another metal alloy, or another combination of metals or otherconductive materials. The semiconductor device package 40050 alsoincludes a package body 40006 that covers or encapsulates the electronicdevice 1002 and the interposer components 33070, and is disposed overthe redistribution stack of the RDLs 40026, 40030, and 40034 and thedielectric layers 40024, 40028, 40032, and 40036. At least some tracesof the RDL 40026 extend into openings 40024 o in the dielectric layer40024 to electrically connect to conductive pads 40084 that are at leastpartially embedded in the dielectric layer 40024. Interconnectionsbetween traces of the RDL 40034 and the UBMs 40038 can be implemented ashigh density interconnections as explained in the foregoing withreference to FIG. 21, FIG. 22, FIG. 23, and FIG. 24, andinterconnections between traces of the RDL 40026 and the conductive pads40084 can be implemented as high density interconnections as explainedin the foregoing with reference to FIG. 30, FIG. 31, and FIG. 32. Atleast some high density interconnections across different layers of thesemiconductor device package 40050 can be substantially aligned over oneanother to allow more efficient routing of signals and provide a higheroverall density of signal routing circuitry within the semiconductordevice package 40050.

Although the cross-sectional view of FIG. 40 shows the one electronicdevice 1002 in the semiconductor device package 40050, multipleelectronic devices can be included in the semiconductor device package40050. FIG. 41 is a top cross-sectional view of the semiconductor devicepackage 40050 taken along a plane S-S of FIG. 40, according to someembodiments of this disclosure. The cross-sectional view shows multipleelectronic devices, including the electronic device 1002 and anadditional electronic device 1004, and also shows the interposercomponents 33070 as discrete components surrounding the electronicdevices 1002 and 1004 and encapsulated in the package body 40006.

Attention next turns to FIG. 42, which shows a cross-sectional view of astacked package assembly 42000 according to some embodiments of thisdisclosure. The stacked package assembly 42000 includes a semiconductordevice package 42050 and an electronic component 33052 disposed over thesemiconductor device package 42050 and electrically connected to thesemiconductor device package 42050 through connectors 33054. Certaincomponents of the stacked package assembly 42000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assemblies 33000, 36000, 38000, and 40000, andrepetition of detailed explanation is omitted. For example, and similarto the semiconductor device package 40050 of FIG. 40, the semiconductordevice package 42050 also includes a redistribution stack of one or moreRDLs 40026, 40030, and 40034 and one or more dielectric layers 40024,40028, 40032, and 40036, UBMs 40038 are disposed over the dielectriclayer 40036 and are electrically connect to traces of the RDL 40034through the dielectric layer 40036, and traces of the RDL 40026 areelectrically connected to conductive pads 40084 that are at leastpartially embedded in the dielectric layer 40024. An electronic device1002 is electrically connected to the redistribution stack throughconnectors 40082 a by, for example, flip-chip mounting. Interconnectionsbetween traces of the RDLs 40026, 40030, and 40034 can be implemented ashigh density interconnections as explained in the foregoing withreference to FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, andFIG. 18, interconnections between traces of the RDL 40034 and the UBMs40038 can be implemented as high density interconnections as explainedin the foregoing with reference to FIG. 21, FIG. 22, FIG. 23, and FIG.24, and interconnections between traces of the RDL 40026 and theconductive pads 40084 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.30, FIG. 31, and FIG. 32. At least some high density interconnectionsacross different layers of the semiconductor device package 42050 can besubstantially aligned over one another to allow more efficient routingof signals and provide a higher overall density of signal routingcircuitry within the semiconductor device package 42050.

As illustrated in FIG. 42 and in place of interposer components, thesemiconductor device package 42050 includes conductive posts 42080extending between a front surface 42020 of a package body 42006 and aback surface 42022 of the package body 42006. At least a portion of aterminal end of each conductive post 42080 is exposed from the frontsurface 42020 of the package body 42006 and is electrically connected toa respective UBM 40038, and at least a portion of an opposite terminalend of each conductive post 42080 is exposed from the back surface 42022of the package body 42006 and is electrically connected to theelectronic component 33052 through a respective connector 33054. Theconductive posts 42080 can be formed from, or can include, copper, acopper alloy, or another metal, another metal alloy, or anothercombination of metals or other conductive materials.

Although the cross-sectional view of FIG. 42 shows the one electronicdevice 1002 in the semiconductor device package 42050, multipleelectronic devices can be included in the semiconductor device package42050. FIG. 43 is a top cross-sectional view of the semiconductor devicepackage 42050 taken along a plane T-T of FIG. 42, according to someembodiments of this disclosure. The cross-sectional view shows multipleelectronic devices, including the electronic device 1002 and anadditional electronic device 1004, and also shows the conductive posts42080 surrounding the electronic devices 1002 and 1004 and encapsulatedin the package body 42006.

In additional embodiments of a stacked package assembly, a semiconductordevice package includes a redistribution stack of one or more RDLs andone or more dielectric layers disposed over a front surface of a packagebody and a redistribution stack of one or more RDLs and one or moredielectric layers disposed over a back surface of the package body. RDLsdisposed over the back surface of the package body can provideelectrical pathways that are routed between conductive vias ofinterposer components (or conductive posts) and an electronic componentdisposed over the semiconductor device package. In such manner, anincrease in flexibility in an arrangement and a spacing of connectionsto the electronic component can be attained, with reduced dependenceupon an arrangement and a spacing of the conductive vias of theinterposer components (or the conductive posts). Within thesemiconductor device package, high density interconnections using RDLsprovide a high density of signal, power, and ground traces connectingelectronic devices within the package as well as a high density oftraces providing connections external to the package, includingconnections to the electronic component disposed over the package.

Referring to FIG. 44, a cross-sectional view is shown of a stackedpackage assembly 44000 according to some embodiments of this disclosure.The stacked package assembly 44000 includes a semiconductor devicepackage 44050 and an electronic component 44052 disposed over thesemiconductor device package 44050 and electrically connected to thesemiconductor device package 44050 through connectors 44054. Certaincomponents of the stacked package assembly 44000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assemblies 33000, 36000, 38000, 40000, and42000, and repetition of detailed explanation is omitted. For exampleand similar to the semiconductor device package 33050 shown in FIG. 33,the semiconductor device package 44050 shown in FIG. 44 also includes aredistribution stack of one or more RDLs 33026, 33030, and 33034 and oneor more dielectric layers 33024, 33028, 33032, and 33036 disposed overan active surface 1008 of an electronic device 1002, lower surfaces33074 of interposer components 33070, and a front surface 33020 of apackage body 33006, and UBMs 33038 are disposed over the dielectriclayer 33036 and are electrically connected to the RDL 33034 through thedielectric layer 33036. Interconnections between traces of the RDL 33026and contact pads 1012 of the electronic device 1002 can be implementedas high density interconnections as explained in the foregoing withreference to FIG. 5, FIG. 6, FIG. 7, and FIG. 8, interconnectionsbetween traces of the RDLs 33026, 33030, and 33034 can be implemented ashigh density interconnections as explained in the foregoing withreference to FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, andFIG. 18, interconnections between traces of the RDL 33034 and the UBMs33038 can be implemented as high density interconnections as explainedin the foregoing with reference to FIG. 21, FIG. 22, FIG. 23, and FIG.24, and interconnections between traces of the RDL 33026 and conductivevias 33072 of the interposer components 33070 can be implemented as highdensity interconnections as explained in the foregoing with reference toFIG. 35.

As illustrated in FIG. 44, the semiconductor device package 44050 alsoincludes a redistribution stack of one or more RDLs and one or moredielectric layers disposed over upper surfaces 33076 of the interposercomponents 33070 and a back surface 33022 of the package body 33006. Asillustrated, a dielectric layer 44024 is disposed over the back surface33022 of the package body 33006, an RDL 44026 is disposed over thedielectric layer 44024 and is electrically connected to the conductivevias 33072 of the interposer components 33070 through the dielectriclayer 44024, a dielectric layer 44028 is disposed over the RDL 44026, anRDL 44030 is disposed over the dielectric layer 44028 and iselectrically connected to the RDL 44026 through the dielectric layer44028, a dielectric layer 44032 is disposed over the RDL 44030, and UBMs44038 are disposed over the dielectric layer 44032 and are electricallyconnected to the RDL 44030 through the dielectric layer 44032. Theelectronic component 44052 is electrically connected to the UBMs 44038through the connectors 44054. At least some traces of the RDL 44026extend into openings 44024 o in the dielectric layer 44024 toelectrically connect to the conductive vias 33072 of the interposercomponents 33070. Certain components of the redistribution stack of theRDLs 44026 and 44030 and the dielectric layers 44024, 44028, and 44032can be similarly implemented as explained in the foregoing, andrepetition of detailed explanation is omitted. Interconnections betweentraces of the RDLs 44026 and 44030 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, and FIG. 18,interconnections between traces of the RDL 44030 and the UBMs 44038 canbe implemented as high density interconnections as explained in theforegoing with reference to FIG. 21, FIG. 22, FIG. 23, and FIG. 24, andinterconnections between traces of the RDL 44026 and the conductive vias33072 of the interposer components 33070 can be implemented as highdensity interconnections as explained in the foregoing with reference toFIG. 35. At least some high density interconnections across differentlayers of the semiconductor device package 44050 can be substantiallyaligned over one another to allow more efficient routing of signals andprovide a higher overall density of signal routing circuitry within thesemiconductor device package 44050.

As illustrated, the RDLs 44026 and 44030 provide electrical pathwaysthat are routed between the conductive vias 33072 of the interposercomponents 33070 and the electronic component 44052, thereby increasingflexibility in an arrangement and a spacing of the UBMs 44038 thatprovide connections to the electronic component 44052. At least some ofthe connectors 44054 are disposed at least partially outside a lateralperiphery of the electronic device 1002 and adjacent to a lateralperiphery of the semiconductor device package 44050. It is noted thatthe connectors 44054, in general, can be laterally disposed within thelateral periphery of the electronic device 1002, outside of thatperiphery, or both, such that the semiconductor device package 44050 canhave a three-dimensional fan-out configuration, a three-dimensionalfan-in configuration, or a combination of a three-dimensional fan-outand a fan-in configuration.

While the two RDLs 44026 and 44030 and the three dielectric layers44024, 44028, and 44032 are shown disposed over the back surface 33022of the package body 33006 in FIG. 44, it is contemplated that less thantwo or more than two RDLs can be included, and less than three or morethan three dielectric layers can be included in other embodiments. Also,although the cross-sectional view of FIG. 44 shows the one electronicdevice 1002 in the semiconductor device package 44050, multipleelectronic devices can be included in the semiconductor device package44050, in a similar manner to that shown, for example, in FIG. 34.

Attention next turns to FIG. 45, which shows a cross-sectional view of astacked package assembly 45000 according to some embodiments of thisdisclosure. The stacked package assembly 45000 includes a semiconductordevice package 45050 and an electronic component 44052 disposed over thesemiconductor device package 45050 and electrically connected to thesemiconductor device package 45050 through connectors 44054. Certaincomponents of the stacked package assembly 45000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assemblies 33000, 36000, 38000, 40000, 42000,and 44000, and repetition of detailed explanation is omitted. Forexample and similar to the semiconductor device package 33050 shown inFIG. 33, the semiconductor device package 45050 shown in FIG. 45 alsoincludes a redistribution stack of one or more RDLs 33026, 33030, and33034 and one or more dielectric layers 33024, 33028, 33032, and 33036disposed over an active surface 1008 of an electronic device 1002, lowersurfaces 33074 of interposer components 33070, and a front surface 45020of a package body 45006, and UBMs 33038 are disposed over the dielectriclayer 33036 and are electrically connected to the RDL 33034 through thedielectric layer 33036. Interconnections between traces of the RDLs33026, 33030, and 33034 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, and FIG. 18,interconnections between traces of the RDL 33034 and the UBMs 33038 canbe implemented as high density interconnections as explained in theforegoing with reference to FIG. 21, FIG. 22, FIG. 23, and FIG. 24, andinterconnections between traces of the RDL 33026 and conductive vias33072 of the interposer components 33070 can be implemented as highdensity interconnections as explained in the foregoing with reference toFIG. 35.

As illustrated in FIG. 45, the electronic device 1002 is disposedadjacent to a back surface 45022 of the package body 45006 with its backsurface 1010 exposed from the package body 45006, and the semiconductordevice package 45050 includes conductive posts 45080 extending betweenrespective contact pads 1012 of the electronic device 1002 and the frontsurface 45020 of the package body 45006. At least some of the traces ofthe RDL 33026 extend into openings 33024 o in the dielectric layer 33024to electrically connect to the electronic device 1002 through theconductive posts 45080. Interconnections between traces of the RDL 33026and the conductive posts 45080 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.26, FIG. 27, and FIG. 28.

The semiconductor device package 45050 also includes a redistributionstack of one or more RDLs and one or more dielectric layers disposedover upper surfaces 33076 of the interposer components 33070 and theback surface 45022 of the package body 45006. Specifically, conductivepads 45084 are at least partially embedded in a dielectric layer 45024,an RDL 45026 is disposed over the dielectric layer 45024 and iselectrically connected to the conductive pads 45084 through thedielectric layer 45024, a dielectric layer 45028 is disposed over theRDL 45026, an RDL 45030 is disposed over the dielectric layer 45028 andis electrically connected to the RDL 45026 through the dielectric layer45028, a dielectric layer 45032 is disposed over the RDL 45030, and UBMs45038 are disposed over the dielectric layer 45032 and are electricallyconnected to the RDL 45030 through the dielectric layer 45032. Theinterposer components 33070 are electrically connected to theredistribution stack by, for example, flip-chip mounting. Specifically,the semiconductor device package 45050 includes connectors 45082extending between respective conductive vias 33072 of the interposercomponents 33070 and respective UBMs 45038. As illustrated, theelectronic device 1002 is disposed with its back surface 1010 facingtowards the UBMs 45038. Interconnections between traces of the RDLs45026 and 45030 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 12, FIG. 13, FIG. 14,FIG. 15, FIG. 16, FIG. 17, and FIG. 18, interconnections between tracesof the RDL 45030 and the UBMs 45038 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.21, FIG. 22, FIG. 23, and FIG. 24, and interconnections between tracesof the RDL 45026 and the conductive pads 45084 can be implemented ashigh density interconnections as explained in the foregoing withreference to FIG. 30, FIG. 31, and FIG. 32. At least some high densityinterconnections across different layers of the semiconductor devicepackage 45050 can be substantially aligned over one another to allowmore efficient routing of signals and provide a higher overall densityof signal routing circuitry within the semiconductor device package45050.

As illustrated, the electronic component 44052 is electrically connectedto the conductive pads 45084 through the connectors 44054. The RDLs45026 and 45030 provide electrical pathways that are routed between theconductive vias 33072 of the interposer components 33070 and theelectronic component 44052, thereby increasing flexibility in anarrangement and a spacing of the conductive pads 45084 that provideconnections to the electronic component 44052.

While the two RDLs 45026 and 45030 and the three dielectric layers45024, 45028, and 45032 are shown disposed over the back surface 45022of the package body 45006 in FIG. 45, it is contemplated that less thantwo or more than two RDLs can be included, and less than three or morethan three dielectric layers can be included in other embodiments. Also,although the cross-sectional view of FIG. 45 shows the one electronicdevice 1002 in the semiconductor device package 45050, multipleelectronic devices can be included in the semiconductor device package45050. FIG. 46 is a top cross-sectional view of the semiconductor devicepackage 45050 taken along a plane U-U of FIG. 45, according to someembodiments of this disclosure. The cross-sectional view shows multipleelectronic devices, including the electronic device 1002 and anadditional electronic device 1004, and also shows the interposercomponents 33070 as discrete components surrounding the electronicdevices 1002 and 1004 and encapsulated in the package body 45006.

Attention next turns to FIG. 47, which shows a cross-sectional view of astacked package assembly 47000 according to some embodiments of thisdisclosure. The stacked package assembly 47000 includes a semiconductordevice package 47050 and an electronic component 44052 disposed over thesemiconductor device package 47050 and electrically connected to thesemiconductor device package 47050 through connectors 44054. Certaincomponents of the stacked package assembly 47000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assembly 45000, and repetition of detailedexplanation is omitted.

As illustrated in FIG. 47 and in place of interposer components, thesemiconductor device package 47050 includes conductive posts 47080extending between a front surface 47020 of a package body 47006 and aback surface 47022 of the package body 47006. At least a portion of aterminal end of each conductive post 47080 is exposed from the frontsurface 47020 of the package body 47006 and is electrically connected toa trace of an RDL 33026, and an opposite terminal end of each conductivepost 47080 is electrically connected to a respective UBM 45038.Interconnections between traces of the RDL 33026 and the conductiveposts 47080 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 26, FIG. 27, and FIG.28. At least some high density interconnections across different layersof the semiconductor device package 47050 can be substantially alignedover one another to allow more efficient routing of signals and providea higher overall density of signal routing circuitry within thesemiconductor device package 47050.

Although the cross-sectional view of FIG. 47 shows the one electronicdevice 1002 in the semiconductor device package 47050, multipleelectronic devices can be included in the semiconductor device package47050, in a similar manner as shown, for example, in FIG. 39.

Attention next turns to FIG. 48, which shows a cross-sectional view of astacked package assembly 48000 according to some embodiments of thisdisclosure. The stacked package assembly 48000 includes a semiconductordevice package 48050 and an electronic component 44052 disposed over thesemiconductor device package 48050 and electrically connected to thesemiconductor device package 48050 through connectors 44054. Certaincomponents of the stacked package assembly 48000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assemblies 33000, 36000, 38000, 40000, 42000,44000, 45000, and 47000, and repetition of detailed explanation isomitted. For example and similar to the semiconductor device package44050 shown in FIG. 44, the semiconductor device package 48050 shown inFIG. 48 also includes a redistribution stack of one or more RDLs 33026,33030, and 33034 and one or more dielectric layers 33024, 33028, 33032,and 33036 disposed over an active surface 1008 of an electronic device1002, lower surfaces 33074 of interposer components 33070, and a frontsurface 48020 of a package body 48006, and UBMs 33038 are disposed overthe dielectric layer 33036 and are electrically connected to the RDL33034 through the dielectric layer 33036. Interconnections betweentraces of the RDLs 33026, 33030, and 33034 can be implemented as highdensity interconnections as explained in the foregoing with reference toFIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, and FIG. 18, andinterconnections between traces of the RDL 33034 and the UBMs 33038 canbe implemented as high density interconnections as explained in theforegoing with reference to FIG. 21, FIG. 22, FIG. 23.

Also similar to the semiconductor device package 44050 shown in FIG. 44,the semiconductor device package 48050 shown in FIG. 48 includes aredistribution stack of one or more RDLs 44026 and 44030 and one or moredielectric layers 44024, 44028, and 44032 disposed over a back surface1010 of the electronic device 1002, upper surfaces 33076 of theinterposer components 33070, and a back surface 48022 of the packagebody 48006. UBMs 44038 are disposed over the dielectric layer 44032 andare electrically connected to the RDL 44030 through the dielectric layer44032, and traces of the RDL 44026 are electrically connected toconductive vias 33072 of the interposer components 33070 through thedielectric layer 44024. Interconnections between traces of the RDLs44026 and 44030 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 12, FIG. 13, FIG. 14,FIG. 15, FIG. 16, FIG. 17, and FIG. 18, interconnections between tracesof the RDL 44030 and the UBMs 44038 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.21, FIG. 22, FIG. 23, and FIG. 24, and interconnections between tracesof the RDL 44026 and the conductive vias 33072 of the interposercomponents 33070 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 35.

As illustrated in FIG. 48, the electronic device 1002 and the interposercomponents 33070 are disposed adjacent to the back surface 48022 of thepackage body 48006 with their back surface 1010 and upper surfaces 33076exposed from the package body 48006, and the semiconductor devicepackage 48050 includes conductive posts 48080 a extending betweenrespective contact pads 1012 of the electronic device 1002 and the frontsurface 48020 of the package body 48006, as well as conductive posts48080 b extending between respective conductive vias 33072 of theinterposer components 33070 and the front surface 48020 of the packagebody 48006. The RDL 33026 is electrically connected to the electronicdevice 1002 and the interposer components 33070 through the conductiveposts 48080 a and 48080 b. Interconnections between traces of the RDL33026 and the conductive posts 48080 a and 48080 b can be implemented ashigh density interconnections as explained in the foregoing withreference to FIG. 26, FIG. 27, and FIG. 28. At least some high densityinterconnections across different layers of the semiconductor devicepackage 48050 can be substantially aligned over one another to allowmore efficient routing of signals and provide a higher overall densityof signal routing circuitry within the semiconductor device package48050.

Although the cross-sectional view of FIG. 48 shows the one electronicdevice 1002 in the semiconductor device package 48050, multipleelectronic devices can be included in the semiconductor device package48050, in a similar manner as shown, for example, in FIG. 37.

Attention next turns to FIG. 49, which shows a cross-sectional view of astacked package assembly 49000 according to some embodiments of thisdisclosure. The stacked package assembly 49000 includes a semiconductordevice package 49050 and an electronic component 44052 disposed over thesemiconductor device package 49050 and electrically connected to thesemiconductor device package 49050 through connectors 44054. Certaincomponents of the stacked package assembly 49000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package assemblies 33000, 36000, 38000, 40000, 42000,44000, 45000, 47000, and 48000, and repetition of detailed explanationis omitted. For example and similar to the semiconductor device package40050 shown in FIG. 40, the semiconductor device package 49050 shown inFIG. 49 also includes an electronic device 1002 and interposercomponents 33070, which are disposed over a redistribution stack of oneor more RDLs 40026, 40030, and 40034 and one or more dielectric layers40024, 40028, 40032, and 40036, and are electrically connected to theredistribution stack by, for example, flip-chip mounting. UBMs 40038 aredisposed over the dielectric layer 40036 and are electrically connectedto the RDL 40034 through the dielectric layer 40036, and the electronicdevice 1002 and the interposer components 33070 are electricallyconnected to the UBMs 40038 through connectors 40082 a and 40082 b. TheRDL 40026 is electrically connected to conductive pads 40084 that are atleast partially embedded in the dielectric layer 40024. Interconnectionsbetween traces of the RDLs 40026, 40030, and 40034 can be implemented ashigh density interconnections as explained in the foregoing withreference to FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17, andFIG. 18, interconnections between traces of the RDL 40034 and the UBMs40038 can be implemented as high density interconnections as explainedin the foregoing with reference to FIG. 21, FIG. 22, FIG. 23, and FIG.24, and interconnections between traces of the RDL 40026 and theconductive pads 40084 can be implemented as high densityinterconnections as explained in the foregoing with reference to FIG.30, FIG. 31, and FIG. 32.

As illustrated in FIG. 49, the semiconductor device package 49050 alsoincludes a redistribution stack of one or more RDLs and one or moredielectric layers disposed over upper surfaces 33076 of the interposercomponents 33070 and a back surface 49022 of a package body 49006.Specifically, a dielectric layer 44024 is disposed over the back surface49022 of the package body 49006, an RDL 44026 is disposed over thedielectric layer 44024 and is electrically connected to conductive vias33072 of the interposer components 33070 through the dielectric layer44024, a dielectric layer 44028 is disposed over the RDL 44026, an RDL44030 is disposed over the dielectric layer 44028 and is electricallyconnected to the RDL 44026 through the dielectric layer 44028, adielectric layer 44032 is disposed over the RDL 44030, and UBMs 44038are disposed over the dielectric layer 44032 and are electricallyconnected to the RDL 44030 through the dielectric layer 44032. Theelectronic component 44052 is electrically connected to the UBMs 44038through the connectors 44054. Interconnections between traces of theRDLs 44026 and 44030 can be implemented as high density interconnectionsas explained in the foregoing with reference to FIG. 12, FIG. 13, FIG.14, FIG. 15, FIG. 16, FIG. 17, and FIG. 18, interconnections betweentraces of the RDL 44030 and the UBMs 44038 can be implemented as highdensity interconnections as explained in the foregoing with reference toFIG. 21, FIG. 22, FIG. 23, and FIG. 24, and interconnections betweentraces of the RDL 44026 and the conductive vias 33072 of the interposercomponents 33070 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 35. At least some highdensity interconnections across different layers of the semiconductordevice package 49050 can be substantially aligned over one another toallow more efficient routing of signals and provide a higher overalldensity of signal routing circuitry within the semiconductor devicepackage 49050.

Although the cross-sectional view of FIG. 49 shows the one electronicdevice 1002 in the semiconductor device package 49050, multipleelectronic devices can be included in the semiconductor device package49050, in a similar manner as shown, for example, in FIG. 41.

Attention next turns to FIG. 50, which shows a cross-sectional view of astacked package assembly 50000 according to some embodiments of thisdisclosure. The stacked package assembly 50000 includes a semiconductordevice package 50050 and an electronic component 44052 disposed over thesemiconductor device package 50050 and electrically connected to thesemiconductor device package 50050 through connectors 44054. Certaincomponents of the stacked package assembly 50000 and interconnectionsbetween the components can be similarly implemented as explained abovefor the stacked package 49000, and repetition of detailed explanation isomitted.

As illustrated in FIG. 50 and in place of interposer components, thesemiconductor device package 50050 includes conductive posts 50080extending between a front surface 50020 of a package body 50006 and aback surface 50022 of the package body 50006. At least a portion of aterminal end of each conductive post 50080 is exposed from the backsurface 50022 of the package body 50006 and is electrically connected toa trace of an RDL 44026, and an opposite terminal end of each conductivepost 50080 is electrically connected to a respective UBM 40038.Interconnections between traces of the RDL 44026 and the conductiveposts 50080 can be implemented as high density interconnections asexplained in the foregoing with reference to FIG. 26, FIG. 27, and FIG.28. At least some high density interconnections across different layersof the semiconductor device package 50050 can be substantially alignedover one another to allow more efficient routing of signals and providea higher overall density of signal routing circuitry within thesemiconductor device package 50050.

Although the cross-sectional view of FIG. 50 shows one electronic device1002 in the semiconductor device package 50050, multiple electronicdevices can be included in the semiconductor device package 50050, in asimilar manner as shown, for example, in FIG. 43.

Additional embodiments of this disclosure are directed to manufacturingprocesses of semiconductor device packages including high densityinterconnections. In some embodiments, high density interconnections areattained by forming traces extending into or through dielectric openingswith capture pads omitted. The formation of such interconnections iscarried out in manufacturing processes including wafer-level packagingprocesses and fan-out or fan-in packaging processes.

FIG. 51A through FIG. 51H show a sequence of stages of a manufacturingprocess of a semiconductor device package, according to some embodimentsof this disclosure. The manufacturing process can be referred to as a“chip first, face down” process. The following manufacturing operationsare explained with reference to the semiconductor device package 1000 ofFIG. 1. However, it is contemplated that the manufacturing operationscan be similarly carried out to form other semiconductor device packagesthat are differently configured. In addition, it is contemplated thatthe manufacturing operations can form an array of connectedsemiconductor device packages that can be separated, such as throughsingulation, to form multiple individual semiconductor device packages.

As shown in FIG. 51A, a carrier 51000 and an adhesive layer 51002disposed over the carrier 51000 are provided. The carrier 51000 can beany of a variety of suitable carriers, such as wafers or panels. Next,electronic devices 1002 and 1004 are disposed over the carrier 51000 andare affixed to the adhesive layer 51002 with their active surfaces 1008and 1014 facing the adhesive layer 51002. The electronic device 1002includes contact pads 1012 adjacent to the active surface 1008, and theelectronic device 1004 includes contact pads 1018 adjacent to the activesurface 1014. Positioning of the electronic devices 1002 and 1004 overthe adhesive layer 51002 can be performed using, for example, apick-and-place equipment or a die-attach equipment.

Next and referring to FIG. 51B, a package body 1006 is formed to coveror encapsulate the electronic devices 1002 and 1004, with their activesurfaces 1008 and 1014 at least partially exposed from or uncovered bythe package body 1006. The package body 1006 can be formed from, or caninclude, a molding material, and can be formed using any of a variety ofmolding techniques, such as transfer molding, injection molding, orcompression molding. The package body 1006 includes a front surface 1020and a back surface 1022 opposite to the front surface 1020.

Next and referring to FIG. 51C, the package body 1006 along with theencapsulated electronic devices 1002 and 1004 are separated from thecarrier 51000 and the adhesive layer 51002, and are reoriented anddisposed over a carrier 51004, with the active surfaces 1008 and 1014 ofthe electronic devices 1002 and 1004 facing away from the carrier 51004,and the back surface 1022 of the package body 1006 facing the carrier51004.

Next, a redistribution stack is formed over the active surfaces 1008 and1014 of the electronic devices 1002 and 1004 and the front surface 1020of the package body 1006. As shown in FIG. 51D, a dielectric layer 1024is formed over the electronic devices 1002 and 1004 and the package body1006, and an RDL 1026 is formed over the dielectric layer 1024. The RDL1026 includes multiple traces, including a trace 1026 a, and at leastsome of the traces of the RDL 1026 extend into openings 1024 o in thedielectric layer 1024 to electrically connect to the contact pads 1012and 1018 of the electronic devices 1002 and 1004 to provide high densitycontact pad-to-RDL interconnections. The RDL 1026 can be formed from, orcan include, copper, a copper alloy, or another metal, another metalalloy, or another combination of metals or other conductive materials.The dielectric layer 1024 can be formed from, or can include, adielectric material that is polymeric or non-polymeric. For example, thedielectric layer 1024 can be formed from polyimide, polybenzoxazole, abenzocyclobutene-based polymer, or a combination thereof. For certainembodiments, the dielectric layer 1024 can be formed from a dielectricmaterial that is photoimageable or photoactive, or from a printabledielectric material.

Attention next turns to FIG. 52A through FIG. 52J, which show a sequenceof stages of forming a high density contact pad-to-RDL interconnectionaccording to some embodiments of this disclosure. For ease ofpresentation, the following manufacturing operations are explained withreference to an interconnection between the contact pad 1012 and thetrace 1026 a. However, it is contemplated that the manufacturingoperations can be similarly carried out to form interconnections betweenadditional traces of the RDL 1026 and the contact pads 1012 and 1018 ofthe electronic devices 1002 and 1004.

As shown in FIG. 52A, the electronic device 1002 is provided andincludes the contact pad 1012 adjacent to its active surface 1008. Nextand referring to FIG. 52B, a dielectric layer 52000 is formed over theactive surface 1008 of the electronic device 1002. The dielectric layer52000 can be formed by applying a dielectric material using any of avariety of coating or deposition techniques, such as spinning orspraying.

Next and referring to FIG. 52C, a patterned photoresist layer 52002 isformed over the dielectric layer 52000 and defines an opening 52002 oaligned with the contact pad 1012. The patterned photoresist layer 52002can be formed by applying a photoresist, followed by photolithography toform the opening 52002 o in the patterned photoresist layer 52002.

Etching of the dielectric layer 52000 is performed using the patternedphotoresist layer 52002 as a mask, thereby forming the dielectric layer1024 and the opening 1024 o in the dielectric layer 1024 as shown inFIG. 52D. Etching of the dielectric layer 52000 can be performed usingdry etching or another suitable material removal technique. The opening1024 o formed in the dielectric layer 1024 exposes a portion of thecontact pad 1012. For certain embodiments, the dielectric layer 1024 canbe formed from a dielectric material that is photoimageable orphotoactive, and can be patterned to form the opening 1024 o by exposureto light through an optical mask, without requiring the patternedphotoresist layer 52002. In such embodiments, the dielectric layer 1024can be formed by directly patterning the dielectric layer 52000 andomitting the stages shown in FIG. 52C and FIG. 52D.

As shown in FIG. 52E, the patterned photoresist layer 52002 is removedby stripping, and next, as shown in FIG. 52F, a seed layer 52004 isformed over the dielectric layer 1024 and extends into the opening 1024o and is formed over the exposed portion of the contact pad 1012. Theseed layer 52004 can be formed from, or can include, titanium, copper, acombination of titanium and copper, or another metal, a metal alloy, oranother combination of metals or other conductive materials, and can beformed by sputtering or another suitable deposition technique.

Next and referring to FIG. 52G, a patterned photoresist layer 52006 isformed over the seed layer 52004 and defines an opening 52006 o alignedwith the opening 1024 o. The patterned photoresist layer 52006 can beformed by applying a photoresist, followed by photolithography to formthe opening 52006 o in the patterned photoresist layer 52006. As shownin FIG. 52G, the opening 1024 o has a maximum width w1 along atransverse direction TD, the opening 52006 o has a maximum width w3along the transverse direction TD, and the maximum width w3 of theopening 52006 o is no greater than or less than the maximum width w1 ofthe opening 1024 o. In some embodiments, the maximum width w3 of theopening 52006 o is no greater than about 9/10, no greater than about ⅘,no greater than about 7/10, no greater than about ⅗, no greater thanabout ½, no greater than about ⅖, or no greater than about ⅓ of themaximum width w1 of the opening 1024 o.

Next and referring to FIG. 52H, the trace 1026 a is formed in theopening 52006 o of the patterned photoresist layer 52006 and includes aportion 5004 extending into the opening 1024 o of the dielectric layer1024. The trace 1026 a can be formed by plating or another suitabledeposition technique.

As shown in FIG. 52I, the patterned photoresist layer 52006 is removedby stripping, and, next, exposed portions of the seed layer 52004 areremoved by etching or another suitable material removal technique. Aremaining portion of the seed layer 52004 disposed below the trace 1026a can be considered to be a part of the trace 1026 a in someembodiments. Referring to FIG. 52I, the portion 5004 of the trace 1026 ain the opening 1024 o has the maximum width w3 along the transversedirection TD which is no greater than or less than the maximum width w1of the opening 1024 o along the transverse direction TD. As illustrated,the portion 5004 of the trace 1026 a is disposed between and spaced fromopposing sidewalls of the dielectric layer 1024 forming the opening 1024o. In some embodiments, the maximum width w3 of the portion 5004 is nogreater than about 9/10, no greater than about ⅘, no greater than about7/10, no greater than about ⅗, no greater than about ½, no greater thanabout ⅖, or no greater than about ⅓ of the maximum width w1 of theopening 1024 o. FIG. 52J shows another cross-sectional view of theresulting contact pad-to-RDL interconnection taken along a longitudinaldirection LD orthogonal to the transverse direction TD. As illustrated,the trace 1026 a includes a portion 5002 extending over the dielectriclayer 1024 along the longitudinal direction LD adjacent to the opening1024 o, and the portion 5004 in the opening 1024 o and extending betweenthe portion 5002 and the exposed portion of the contact pad 1012.

Formation of the redistribution stack next continues with reference toFIG. 51E. As illustrated, a dielectric layer 1028 is formed over the RDL1026 and the dielectric layer 1024, and an RDL 1030 is formed over thedielectric layer 1028. The RDL 1030 includes multiple traces, includinga trace 1030 a, and at least some of the traces of the RDL 1030 extendinto openings 1028 o in the dielectric layer 1028 to electricallyconnect to the traces of the RDL 1026 to provide high density RDL-to-RDLinterconnections. The RDL 1030 and the dielectric layer 1028 can beformed from similar materials as explained above for the RDL 1026 andthe dielectric layer 1024.

Attention next turns to FIG. 53A through FIG. 53H, which show a sequenceof stages of forming a high density RDL-to-RDL interconnection accordingto some embodiments of this disclosure. For ease of presentation, thefollowing manufacturing operations are explained with reference to aninterconnection between the trace 1030 a and the trace 1026 a. However,it is contemplated that the manufacturing operations can be similarlycarried out to form additional interconnections between traces of theRDLs 1026 and 1030.

As shown in FIG. 53A, the trace 1026 a extends over the dielectric layer1024. Next and referring to FIG. 53B, a dielectric layer 53000 is formedover the trace 1026 a and the dielectric layer 1024. The dielectriclayer 53000 can be formed by applying a dielectric material using any ofa variety of coating or deposition techniques, such as spinning orspraying. The dielectric layer 53000 is next patterned to form thedielectric layer 1028 and the opening 1028 o in the dielectric layer1028, as shown in FIG. 53C. The opening 1028 o formed in the dielectriclayer 1028 exposes a portion of the trace 1026 a. Patterning of thedielectric layer 53000 can be performed by etching using a patternedphotoresist layer as a mask, or by direct patterning of a dielectricmaterial that is photoimageable or photoactive.

Next, as shown in FIG. 53D, a seed layer 53002 is formed over thedielectric layer 1028 and extends into the opening 1028 o and is formedover the exposed portion of the trace 1026 a. The seed layer 53002 canbe formed from, or can include, titanium, copper, a combination oftitanium and copper, or another metal, a metal alloy, or anothercombination of metals or other conductive materials, and can be formedby sputtering or another suitable deposition technique.

Next and referring to FIG. 53E, a patterned photoresist layer 53004 isformed over the seed layer 53002 and defines an opening 53004 o alignedwith the opening 10280. The patterned photoresist layer 53004 can beformed by applying a photoresist, followed by photolithography to formthe opening 53004 o in the patterned photoresist layer 53004. As shownin FIG. 53E, the opening 1028 o has a maximum width w4 along atransverse direction TD, the opening 53004 o has a maximum width w5along the transverse direction TD, and the maximum width w5 of theopening 53004 o is no greater than or less than the maximum width w4 ofthe opening 10280. In some embodiments, the maximum width w5 of theopening 53004 o is no greater than about 9/10, no greater than about ⅘,no greater than about 7/10, no greater than about ⅗, no greater thanabout ½, no greater than about ⅖, or no greater than about ⅓ of themaximum width w4 of the opening 10280.

Next and referring to FIG. 53F, the trace 1030 a is formed in theopening 53004 o of the patterned photoresist layer 53004 and includes aportion 1204 extending into the opening 1028 o of the dielectric layer1028. The trace 1030 a can be formed by plating or another suitabledeposition technique.

As shown in FIG. 53G, the patterned photoresist layer 53004 is removedby stripping, and, next, exposed portions of the seed layer 53002 areremoved by etching or another suitable material removal technique. Aremaining portion of the seed layer 53002 disposed below the trace 1030a can be considered to be a part of the trace 1030 a in someembodiments. Referring to FIG. 53G, the portion 1204 of the trace 1030 ain the opening 1028 o has the maximum width w5 along the transversedirection TD which is no greater than or less than the maximum width w4of the opening 1028 o along the transverse direction TD. As illustrated,the portion 1204 of the trace 1030 a is disposed between and spaced fromopposing sidewalls of the dielectric layer 1028 forming the opening10280. In some embodiments, the maximum width w5 of the portion 1204 isno greater than about 9/10, no greater than about ⅘, no greater thanabout 7/10, no greater than about ⅗, no greater than about ½, no greaterthan about ⅖, or no greater than about ⅓ of the maximum width w4 of theopening 10280. FIG. 53H shows another cross-sectional view of theresulting RDL-to-RDL interconnection taken along a longitudinaldirection LD orthogonal to the transverse direction TD. As illustrated,the trace 1030 a includes a portion 1202 extending over the dielectriclayer 1028 along the longitudinal direction LD adjacent to the opening1028 o, and the portion 1204 in the opening 1028 o and extending betweenthe portion 1202 and the exposed portion of the trace 1026 a.

Formation of the redistribution stack next continues with reference toFIG. 51F. As illustrated, a dielectric layer 1032 is formed over the RDL1030 and the dielectric layer 1028, and an RDL 1034 is formed over thedielectric layer 1032. The RDL 1034 includes multiple traces, includinga trace 1034 a, and at least some of the traces of the RDL 1034 extendinto openings 1032 o in the dielectric layer 1032 to electricallyconnect to the traces of the RDL 1030 to provide high density RDL-to-RDLinterconnections. Formation of such RDL-to-RDL interconnections can beperformed similarly as explained in the foregoing with reference to FIG.53A through FIG. 53H. The RDL 1034 and the dielectric layer 1032 can beformed from similar materials as explained above for the RDL 1026 andthe dielectric layer 1024.

Referring next to FIG. 51G, a dielectric layer 1036 is formed over theRDL 1034 and the dielectric layer 1032, and UBMs 1038 are formed overthe dielectric layer 1036 and extend into openings 1036 o in thedielectric layer 1036 to electrically connect to the traces of the RDL1034 to provide high density RDL-to-UBM interconnections. The dielectriclayer 1036 can be formed from similar materials as explained above forthe dielectric layer 1024. The UBMs 1038 can be formed from, or caninclude, a metal, a metal alloy, or another combination of metals orother conductive materials.

Attention next turns to FIG. 54A through FIG. 54G, which show a sequenceof stages of forming a high density RDL-to-UBM interconnection accordingto some embodiments of this disclosure. For ease of presentation, thefollowing manufacturing operations are explained with reference to aninterconnection between the trace 1034 a and the UBM 1038. However, itis contemplated that the manufacturing operations can be similarlycarried out to form interconnections between additional traces of theRDL 1034 and the UBMs 1038.

As shown in FIG. 54A, the trace 1034 a extends over the dielectric layer1032. Next and referring to FIG. 54B, a dielectric layer 54000 is formedover the trace 1034 a and the dielectric layer 1032. The dielectriclayer 54000 can be formed by applying a dielectric material using any ofa variety of coating or deposition techniques, such as spinning orspraying. The dielectric layer 54000 is next patterned to form thedielectric layer 1036 and the opening 1036 o in the dielectric layer1036, as shown in FIG. 54C. The opening 1036 o formed in the dielectriclayer 1036 exposes a portion of the trace 1034 a. Patterning of thedielectric layer 54000 can be performed by etching using a patternedphotoresist layer as a mask, or by direct patterning of a dielectricmaterial that is photoimageable or photoactive. As illustrated, theexposed portion of the trace 1034 a is disposed between and spaced fromopposing sidewalls of the dielectric layer 1036 forming the opening 1036o.

Next, as shown in FIG. 54D, a seed layer 54002 is formed over thedielectric layer 1036 and extends into the opening 1036 o and is formedover the exposed portion of the trace 1034 a. The seed layer 54002 canbe formed from, or can include, titanium, copper, a combination oftitanium and copper, or another metal, a metal alloy, or anothercombination of metals or other conductive materials, and can be formedby sputtering or another suitable deposition technique.

Next and referring to FIG. 54E, a patterned photoresist layer 54004 isformed over the seed layer 54002 and defines an opening 54004 o alignedwith the opening 1036 o. The patterned photoresist layer 54004 can beformed by applying a photoresist, followed by photolithography to formthe opening 54004 o in the patterned photoresist layer 54004.

Next and referring to FIG. 54F, the UBM 1038 is formed in the opening54004 o of the patterned photoresist layer 54004 and extends into theopening 1036 o of the dielectric layer 1036. The UBM 1038 can be formedby plating or another suitable deposition technique.

As shown in FIG. 54G, the patterned photoresist layer 54004 is removedby stripping, and, next, exposed portions of the seed layer 54002 areremoved by etching or another suitable material removal technique. Aremaining portion of the seed layer 54002 disposed below the UBM 1038can be considered to be a part of the UBM 1038 in some embodiments.Referring to FIG. 54G, the trace 1034 a extends along a longitudinaldirection LD adjacent to a projection area of the UBM 1038 onto thetrace 1034 a and the dielectric layer 1032, and the trace 1034 aincludes a portion 21004 that overlaps the projection area of the UBM1038. The UBM 1038 has a maximum width w9 along a transverse directionTD orthogonal to the longitudinal direction LD, and a maximum width w10of the overlapping portion 21004 of the trace 1034 a is no greater thanabout ⅓ of the maximum width w9 of the UBM 1038, such as no greater thanabout ¼, no greater than about ⅕, or no greater than about ⅙ of themaximum width w9 of the UBM 1038.

Referring next to FIG. 51H, electrical contacts 1040, such as in theform of conductive bumps, are formed over the UBMs 1038, and, forembodiments in which an array of connected semiconductor device packagesare formed, singulation is performed (as shown by arrows in FIG. 51H) toform individual semiconductor device packages, including thesemiconductor device package 1000.

FIG. 55A through FIG. 55F show a sequence of stages of a manufacturingprocess of a semiconductor device package, according to some embodimentsof this disclosure. The manufacturing process can be referred to as a“chip first, face up” process. The following manufacturing operationsare explained with reference to the semiconductor device package 25000of FIG. 25. However, it is contemplated that the manufacturingoperations can be similarly carried out to form other semiconductordevice packages that are differently configured. In addition, it iscontemplated that the manufacturing operations can form an array ofconnected semiconductor device packages that can be separated, such asthrough singulation, to form multiple individual semiconductor devicepackages. Certain of the following manufacturing operations can besimilarly performed as explained in the foregoing, and repetition ofdetailed explanation is omitted.

As shown in FIG. 55A, a carrier 55000 is provided. Next, electronicdevices 1002 and 1004 are disposed over the carrier 55000 with theiractive surfaces 1008 and 1014 facing away from the carrier 55000.Conductive posts 25080 are disposed over the electronic devices 1002 and1004 and extend from respective contact pads 1012 and 1018 of theelectronic devices 1002 and 1004.

Next and referring to FIG. 55B, a package body 55002 is formed to coveror encapsulate the conductive posts 25080 and the electronic devices1002 and 1004, with their back surfaces 1010 and 1016 at least partiallyexposed from or uncovered by the package body 55002. The package body55002 is next subjected to grinding, lapping, or another suitablematerial removal technique, thereby forming a package body 25006 asshown in FIG. 55C. The package body 25006 includes a front surface25020, and at least a portion of a terminal end of each conductive post25080 is exposed from the front surface 25020 of the package body 25006.

Next, a redistribution stack is formed over the active surfaces 1008 and1014 of the electronic devices 1002 and 1004 and the front surface 25020of the package body 25006. As shown in FIG. 55D, a dielectric layer 1024is formed over the package body 25006, and an RDL 1026 is formed overthe dielectric layer 1024. The RDL 1026 includes multiple traces,including a trace 1026 a, and at least some of the traces of the RDL1026 extend into openings 1024 o in the dielectric layer 1024 toelectrically connect to the electronic devices 1002 and 1004 through theconductive posts 25080 to provide high density conductive post-to-RDLinterconnections.

Attention next turns to FIG. 56A through FIG. 56F, which show a sequenceof stages of forming a high density conductive post-to-RDLinterconnection according to some embodiments of this disclosure. Forease of presentation, the following manufacturing operations areexplained with reference to an interconnection between the trace 1026 aand the conductive post 25080 disposed over the electronic device 1002.However, it is contemplated that the manufacturing operations can besimilarly carried out to form interconnections between additional tracesof the RDL 1026 and the conductive posts 25080 disposed over theelectronic devices 1002 and 1004.

As shown in FIG. 56A, the electronic device 1002 is provided, and theconductive post 25080 extends through the package body 25006 and betweenthe contact pad 1012 of the electronic device 1002 and the front surface25020 of the package body 25006. The dielectric layer 1024 is formedover the conductive post 25080 and the package body 25006, and theopening 1024 o is formed in the dielectric layer 1024 to expose aportion of the terminal end of the conductive post 25080.

Next, as shown in FIG. 56B, a seed layer 56000 is formed over thedielectric layer 1024 and extends into the opening 1024 o and is formedover the exposed portion of the terminal end of the conductive post25080.

Next and referring to FIG. 56C, a patterned photoresist layer 56002 isformed over the seed layer 56000 and defines an opening 56002 o alignedwith the opening 1024 o. As shown in FIG. 56C, the opening 1024 o has amaximum width w1 along a transverse direction TD, the opening 56002 ohas a maximum width w3 along the transverse direction TD, and themaximum width w3 of the opening 56002 o is no greater than or less thanthe maximum width w1 of the opening 1024 o. In some embodiments, themaximum width w3 of the opening 56002 o is no greater than about 9/10,no greater than about ⅘, no greater than about 7/10, no greater thanabout ⅗, no greater than about ½, no greater than about ⅖, or no greaterthan about ⅓ of the maximum width w1 of the opening 1024 o.

Next and referring to FIG. 56D, the trace 1026 a is formed in theopening 56002 o of the patterned photoresist layer 56002 and includes aportion 5004 extending into the opening 1024 o of the dielectric layer1024.

As shown in FIG. 56E, the patterned photoresist layer 56002 is removedby stripping, and, next, exposed portions of the seed layer 56000 areremoved by etching or another suitable material removal technique. Aremaining portion of the seed layer 56000 disposed below the trace 1026a can be considered to be a part of the trace 1026 a in someembodiments. Referring to FIG. 56E, the portion 5004 of the trace 1026 ain the opening 1024 o has the maximum width w3 along the transversedirection TD which is no greater than or less than the maximum width w1of the opening 1024 o along the transverse direction TD. As illustrated,the portion 5004 of the trace 1026 a is disposed between and spaced fromopposing sidewalls of the dielectric layer 1024 forming the opening 1024o. In some embodiments, the maximum width w3 of the portion 5004 is nogreater than about 9/10, no greater than about ⅘, no greater than about7/10, no greater than about ⅗, no greater than about ½, no greater thanabout ⅖, or no greater than about ⅓ of the maximum width w1 of theopening 1024 o. FIG. 56F shows another cross-sectional view of theresulting conductive post-to-RDL interconnection taken along alongitudinal direction LD orthogonal to the transverse direction TD. Asillustrated, the trace 1026 a includes a portion 5002 extending over thedielectric layer 1024 along the longitudinal direction LD adjacent tothe opening 1024 o, and the portion 5004 in the opening 1024 o andextending between the portion 5002 and the exposed portion of theconductive post 25080.

Formation of the redistribution stack next continues with reference toFIG. 55E. As illustrated, a dielectric layer 1028 is formed over the RDL1026 and the dielectric layer 1024, and an RDL 1030 is formed over thedielectric layer 1028. Next, a dielectric layer 1032 is formed over theRDL 1030 and the dielectric layer 1028, and an RDL 1034 is formed overthe dielectric layer 1032. Next, a dielectric layer 1036 is formed overthe RDL 1034 and the dielectric layer 1032, and UBMs 1038 are formedover the dielectric layer 1036.

Referring next to FIG. 55F, electrical contacts 1040, such as in theform of conductive bumps, are formed over the UBMs 1038, and, forembodiments in which an array of connected semiconductor device packagesare formed, singulation is performed (as shown by arrows in FIG. 55F) toform individual semiconductor device packages, including thesemiconductor device package 25000.

FIG. 57A through FIG. 57F show a sequence of stages of a manufacturingprocess of a semiconductor device package, according to some embodimentsof this disclosure. The manufacturing process can be referred to as a“chip last” process. The following manufacturing operations areexplained with reference to the semiconductor device package 29000 ofFIG. 29. However, it is contemplated that the manufacturing operationscan be similarly carried out to form other semiconductor device packagesthat are differently configured. In addition, it is contemplated thatthe manufacturing operations can form an array of connectedsemiconductor device packages that can be separated, such as throughsingulation, to form multiple individual semiconductor device packages.Certain of the following manufacturing operations can be similarlyperformed as explained in the foregoing, and repetition of detailedexplanation is omitted.

As shown in FIG. 57A, a carrier 57000 is provided. Next, aredistribution stack is formed over the carrier 57000. Referring to FIG.57A, conductive pads 29084 are formed over the carrier 57000. Theconductive pads 29084 can be formed from, or can include, copper, acopper alloy, or another metal, another metal alloy, or anothercombination of metals or other conductive materials, and can be formedby plating within openings of a patterned photoresist layer or anothersuitable deposition technique.

Next and referring to FIG. 57B, a dielectric layer 29024 is formed overthe conductive pads 29084 and the carrier 57000, and an RDL 29026 isformed over the dielectric layer 29024. The RDL 29026 includes multipletraces, including a trace 29026 a, and at least some of the traces ofthe RDL 29026 extend into openings 29024 o in the dielectric layer 29024to electrically connect to the conductive pads 29084 to provide highdensity conductive pad-to-RDL interconnections.

Attention next turns to FIG. 58A through FIG. 58F, which show a sequenceof stages of forming a high density conductive pad-to-RDLinterconnection according to some embodiments of this disclosure. Forease of presentation, the following manufacturing operations areexplained with reference to an interconnection between the trace 29026 aand the conductive pad 29084. However, it is contemplated that themanufacturing operations can be similarly carried out to forminterconnections between additional traces of the RDL 29026 and theconductive pads 29084.

As shown in FIG. 58A, the conductive pad 29084 is formed over thecarrier 57000. Next, the dielectric layer 29024 is formed over theconductive pad 29084 and the carrier 57000, and the opening 29024 o isformed in the dielectric layer 29024 to expose a portion of theconductive pad 29084.

Next, as shown in FIG. 58B, a seed layer 58000 is formed over thedielectric layer 29024 and extends into the opening 29024 o and isformed over the exposed portion of the conductive pad 29084.

Next and referring to FIG. 58C, a patterned photoresist layer 58002 isformed over the seed layer 58000 and defines an opening 58002 o alignedwith the opening 29024 o. As shown in FIG. 58C, the opening 29024 o hasa maximum width w12 along a transverse direction TD, the opening 58002 ohas a maximum width w13 along the transverse direction TD, and themaximum width w13 of the opening 58002 o is no greater than or less thanthe maximum width w12 of the opening 29024 o. In some embodiments, themaximum width w13 of the opening 58002 o is no greater than about 9/10,no greater than about ⅘, no greater than about 7/10, no greater thanabout ⅗, no greater than about ½, no greater than about ⅖, or no greaterthan about ⅓ of the maximum width w12 of the opening 29024 o.

Next and referring to FIG. 58D, the trace 29026 a is formed in theopening 58002 o of the patterned photoresist layer 58002 and includes aportion 29004 extending into the opening 29024 o of the dielectric layer29024.

As shown in FIG. 58E, the patterned photoresist layer 58002 is removedby stripping, and, next, exposed portions of the seed layer 58000 areremoved by etching or another suitable material removal technique. Aremaining portion of the seed layer 58000 disposed below the trace 29026a can be considered to be a part of the trace 29026 a in someembodiments. Referring to FIG. 58E, the portion 29004 of the trace 29026a in the opening 29024 o has the maximum width w13 along the transversedirection TD which is no greater than or less than the maximum width w12of the opening 29024 o along the transverse direction TD. Asillustrated, the portion 29004 of the trace 29026 a is disposed betweenand spaced from opposing sidewalls of the dielectric layer 29024 formingthe opening 29024 o. In some embodiments, the maximum width w13 of theportion 29004 is no greater than about 9/10, no greater than about ⅘, nogreater than about 7/10, no greater than about ⅗, no greater than about½, no greater than about ⅖, or no greater than about ⅓ of the maximumwidth w12 of the opening 29024 o. FIG. 58F shows another cross-sectionalview of the resulting conductive pad-to-RDL interconnection taken alonga longitudinal direction LD orthogonal to the transverse direction TD.As illustrated, the trace 29026 a includes a portion 29002 extendingover the dielectric layer 29024 along the longitudinal direction LDadjacent to the opening 29024 o, and the portion 29004 in the opening29024 o and extending between the portion 29002 and the exposed portionof the conductive pad 29084.

Formation of the redistribution stack next continues with reference toFIG. 57C. As illustrated, a dielectric layer 29028 is formed over theRDL 29026 and the dielectric layer 29024, and an RDL 29030 is formedover the dielectric layer 29028. Next, a dielectric layer 29032 isformed over the RDL 29030 and the dielectric layer 29028, and an RDL29034 is formed over the dielectric layer 29032. Next, a dielectriclayer 29036 is formed over the RDL 29034 and the dielectric layer 29032,and UBMs 29038 are formed over the dielectric layer 29036.

Referring next to FIG. 57D, electronic devices 1002 and 1004 aredisposed over the redistribution stack of the RDLs 29026, 29030, and29034 and the dielectric layers 29024, 29028, 29032, and 29036, and areelectrically connected to the UBMs 29038 through connectors 29082 by,for example, flip-chip mounting.

Next and referring to FIG. 57E, a package body 29006 is formed to coveror encapsulate the electronic devices 1002 and 1004, and is disposedover the redistribution stack of the RDLs 29026, 29030, and 29034 andthe dielectric layers 29024, 29028, 29032, and 29036.

Next and referring to FIG. 57F, the package body 29006 and theredistribution stack are separated from the carrier 57000. Electricalcontacts 1040, such as in the form of conductive bumps, are formed overthe conductive pads 29084, and, for embodiments in which an array ofconnected semiconductor device packages are formed, singulation isperformed (as shown by arrows in FIG. 57F) to form individualsemiconductor device packages, including the semiconductor devicepackage 29000.

Additional embodiments of this disclosure are directed to manufacturingprocesses of three-dimensional semiconductor device packages includinghigh density interconnections, such as for stacked package assemblies orPoP assemblies. In some embodiments, high density interconnections areattained by forming traces extending into or through dielectric openingswith capture pads omitted.

FIG. 59A through FIG. 59H show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The manufacturing process can be referred to as a “chipfirst, face down” process. The following manufacturing operations areexplained with reference to the semiconductor device package 33050 andthe stacked package assembly 33000 of FIG. 33. However, it iscontemplated that the manufacturing operations can be similarly carriedout to form other stacked package assemblies that are differentlyconfigured. Certain of the following manufacturing operations can besimilarly performed as explained in the foregoing, and repetition ofdetailed explanation is omitted.

As shown in FIG. 59A, a carrier 59000 and an adhesive layer 59002disposed over the carrier 59000 are provided. Next, an electronic device1002 and interposer components 59004 are disposed over the carrier 59000and are affixed to the adhesive layer 59002. The electronic device 1002is affixed to the adhesive layer 59002 with its active surface 1008facing towards the adhesive layer 59002. Each interposer component 59004includes conductive vias 33072 including terminal ends exposed from alower surface 33074 of the interposer component 59004, and eachinterposer component 59004 is affixed to the adhesive layer 59002 withits lower surface 33074 facing towards the adhesive layer 59002.

Next and referring to FIG. 59B, a package body 59006 is formed to coveror encapsulate the electronic device 1002 and the interposer components59004, with their active surface 1008 and lower surfaces 33074 at leastpartially exposed from or uncovered by the package body 59006. Thepackage body 59006 and the interposer components 59004 are nextsubjected to grinding, lapping, or another suitable material removaltechnique, thereby forming a package body 33006 and interposercomponents 33070 as shown in FIG. 59C. The package body 33006 includes afront surface 33020 and a back surface 33022, and terminal ends of theconductive vias 33072 adjacent to an upper surface 33076 of eachinterposer component 33070 are at least partially exposed from the backsurface 33022 of the package body 33006.

Next and referring to FIG. 59D, the package body 33006 along with theencapsulated electronic device 1002 and the encapsulated interposercomponents 33070 are separated from the carrier 59000 and the adhesivelayer 59002, and are reoriented and disposed over a carrier 59008, withthe active surface 1008 of the electronic device 1002 and the frontsurface 33020 of the package body 33006 facing away from the carrier59008, and the back surface 33022 of the package body 33006 facingtowards the carrier 59008.

Next, a redistribution stack is formed over the active surface 1008 ofthe electronic device 1002 and the front surface 33020 of the packagebody 33006. As shown in FIG. 59E, a dielectric layer 33024 is formedover the electronic device 1002 and the package body 33006, and an RDL33026 is formed over the dielectric layer 33024. The RDL 33026 includesmultiple traces, including a trace 33026 a, and at some of the traces ofthe RDL 33026 extend into openings 33024 o in the dielectric layer 33024to electrically connect to the conductive vias 33072 of the interposercomponents 33070 to provide high density conductive via-to-RDLinterconnections.

Attention next turns to FIG. 60A through FIG. 60F, which show a sequenceof stages of forming a high density conductive via-to-RDLinterconnection according to some embodiments of this disclosure. Forease of presentation, the following manufacturing operations areexplained with reference to an interconnection between the trace 33026 aand the conductive via 33072. However, it is contemplated that themanufacturing operations can be similarly carried out to forminterconnections between additional traces of the RDL 33026 and theconductive vias 33072.

As shown in FIG. 60A, the interposer component 33070 including theconductive via 33072 is provided. Next, the dielectric layer 33024 isformed over the interposer component 33070, and the opening 33024 o isformed in the dielectric layer 33024 to expose a portion of a terminalend of the conductive via 33072.

Next, as shown in FIG. 60B, a seed layer 60000 is formed over thedielectric layer 33024 and extends into the opening 33024 o and isformed over the exposed portion of the conductive via 33072.

Next and referring to FIG. 60C, a patterned photoresist layer 60002 isformed over the seed layer 60000 and defines an opening 60002 o alignedwith the opening 33024 o. As shown in FIG. 60C, the opening 33024 o hasa maximum width w15 along a transverse direction TD, the opening 60002 ohas a maximum width w16 along the transverse direction TD, and themaximum width w16 of the opening 60002 o is no greater than or less thanthe maximum width w15 of the opening 33024 o. In some embodiments, themaximum width w16 of the opening 60002 o is no greater than about 9/10,no greater than about ⅘, no greater than about 7/10, no greater thanabout ⅗, no greater than about ½, no greater than about ⅖, or no greaterthan about ⅓ of the maximum width w15 of the opening 33024 o.

Next and referring to FIG. 60D, the trace 33026 a is formed in theopening 60002 o of the patterned photoresist layer 60002 and includes aportion 35004 extending into the opening 33024 o of the dielectric layer33024.

As shown in FIG. 60E, the patterned photoresist layer 60002 is removedby stripping, and, next, exposed portions of the seed layer 60000 areremoved by etching or another suitable material removal technique. Aremaining portion of the seed layer 60000 disposed below the trace 33026a can be considered to be a part of the trace 33026 a in someembodiments. Referring to FIG. 60E, the portion 35004 of the trace 33026a in the opening 33024 o has the maximum width w16 along the transversedirection TD which is no greater than or less than the maximum width w15of the opening 33024 o along the transverse direction TD. Asillustrated, the portion 35004 of the trace 33026 a is disposed betweenand spaced from opposing sidewalls of the dielectric layer 33024 formingthe opening 33024 o. In some embodiments, the maximum width w16 of theportion 35004 is no greater than about 9/10, no greater than about ⅘, nogreater than about 7/10, no greater than about ⅗, no greater than about½, no greater than about ⅖, or no greater than about ⅓ of the maximumwidth w15 of the opening 33024 o. FIG. 60F shows another cross-sectionalview of the resulting conductive via-to-RDL interconnection taken alonga longitudinal direction LD orthogonal to the transverse direction TD.As illustrated, the trace 33026 a includes a portion 35002 extendingover the dielectric layer 33024 along the longitudinal direction LDadjacent to the opening 33024 o, and the portion 35004 in the opening33024 o and extending between the portion 35002 and the exposed portionof the conductive via 33072.

Formation of the redistribution stack next continues with reference toFIG. 59F. As illustrated, a dielectric layer 33028 is formed over theRDL 33026 and the dielectric layer 33024, and an RDL 33030 is formedover the dielectric layer 33028. Next, a dielectric layer 33032 isformed over the RDL 33030 and the dielectric layer 33028, and an RDL33034 is formed over the dielectric layer 33032. Next, a dielectriclayer 33036 is formed over the RDL 33034 and the dielectric layer 33032,and UBMs 33038 are formed over the dielectric layer 33036.

Referring next to FIG. 59G, electrical contacts 1040, such as in theform of conductive bumps, are formed over the UBMs 33038, and, forembodiments in which an array of connected semiconductor device packagesare formed, singulation is performed (as shown by arrows in FIG. 59G) toform individual semiconductor device packages, including thesemiconductor device package 33050. As shown in FIG. 59H, an electroniccomponent 33052 is then electrically connected to the interposercomponents 33070 of the semiconductor device package 33050 throughconnectors 33054, thereby forming the stacked package assembly 33000.

FIG. 61A through FIG. 61E show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The manufacturing process can be referred to as a “chipfirst, face up” process. The following manufacturing operations areexplained with reference to the semiconductor device package 36050 andthe stacked package assembly 36000 of FIG. 36. However, it iscontemplated that the manufacturing operations can be similarly carriedout to form other stacked package assemblies that are differentlyconfigured. Certain of the following manufacturing operations can besimilarly performed as explained in the foregoing, and repetition ofdetailed explanation is omitted.

As shown in FIG. 61A, a carrier 61000 is provided. Next, an electronicdevice 1002 and interposer components 33070 are disposed over thecarrier 61000. The electronic device 1002 is disposed over the carrier61000 with its active surface 1008 facing away from the carrier 61000.Conductive posts 36080 a are disposed over the electronic device 1002and extend from respective contact pads 1012 of the electronic device1002. Conductive posts 36080 b are disposed over the interposercomponents 33070 and extend from respective conductive vias 33072 of theinterposer components 33070.

Next and referring to FIG. 61B, a package body 61002 is formed to coveror encapsulate the conductive posts 36080 a and 36080 b, the electronicdevice 1002, and the interposer components 33070. The package body 61002is next subjected to grinding, lapping, or another suitable materialremoval technique, thereby forming a package body 36006 as shown in FIG.61C. The package body 36006 includes a front surface 36020, and at leasta portion of a terminal end of each conductive post 36080 a or 36080 bis exposed from the front surface 36020 of the package body 36006.

Next, a redistribution stack is formed over the active surface 1008 ofthe electronic device 1002 and the front surface 36020 of the packagebody 36006. As shown in FIG. 61D, a dielectric layer 33024 is formedover the electronic device 1002 and the package body 36006, and an RDL33026 is formed over the dielectric layer 33024. Next, a dielectriclayer 33028 is formed over the RDL 33026 and the dielectric layer 33024,and an RDL 33030 is formed over the dielectric layer 33028. Next, adielectric layer 33032 is formed over the RDL 33030 and the dielectriclayer 33028, and an RDL 33034 is formed over the dielectric layer 33032.Next, a dielectric layer 33036 is formed over the RDL 33034 and thedielectric layer 33032, and UBMs 33038 are formed over the dielectriclayer 33036.

Referring next to FIG. 61E, electrical contacts 1040, such as in theform of conductive bumps, are formed over the UBMs 33038, and, forembodiments in which an array of connected semiconductor device packagesare formed, singulation is performed (as shown by arrows in FIG. 61E) toform individual semiconductor device packages, including thesemiconductor device package 36050. An electronic component 33052 isthen electrically connected to the semiconductor device package 36050,thereby forming the stacked package assembly 36000 of FIG. 36.

FIG. 62A through FIG. 62C show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The manufacturing process can be referred to as a “chipfirst, face up” process. The following manufacturing operations areexplained with reference to the semiconductor device package 38050 andthe stacked package assembly 38000 of FIG. 38. However, it iscontemplated that the manufacturing operations can be similarly carriedout to form other stacked package assemblies that are differentlyconfigured. Certain of the following manufacturing operations can besimilarly performed as explained in the foregoing, and repetition ofdetailed explanation is omitted.

As shown in FIG. 62A, a carrier 62000 is provided. Next, an electronicdevice 1002 and conductive posts 38080 are disposed over the carrier62000. The electronic device 1002 is disposed over the carrier 62000with its active surface 1008 facing away from the carrier 62000.Conductive posts 36080 a are disposed over the electronic device 1002and extend from respective contact pads 1012 of the electronic device1002. The conductive posts 38080 can be formed over the carrier 62000,such as by plating within openings of a patterned photoresist layer oranother suitable deposition technique.

Next and referring to FIG. 62B, a package body 62002 is formed to coveror encapsulate the conductive posts 36080 a and 38080 and the electronicdevice 1002. The package body 62002 is next subjected to grinding,lapping, or another suitable material removal technique, thereby forminga package body 38006 as shown in FIG. 62C. The package body 38006includes a front surface 38020, and at least a portion of a terminal endof each conductive post 36080 a or 38080 is exposed from the frontsurface 38020 of the package body 38006. Subsequent manufacturingoperations can be similarly performed as explained in the foregoing withreference to FIG. 61A through FIG. 61E, thereby forming thesemiconductor device package 38050 and the stacked package assembly38000 of FIG. 38.

FIG. 63A through FIG. 63E show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The manufacturing process can be referred to as a “chiplast” process. The following manufacturing operations are explained withreference to the semiconductor device package 40050 and the stackedpackage assembly 40000 of FIG. 40. However, it is contemplated that themanufacturing operations can be similarly carried out to form otherstacked package assemblies that are differently configured. Certain ofthe following manufacturing operations can be similarly performed asexplained in the foregoing, and repetition of detailed explanation isomitted.

As shown in FIG. 63A, a carrier 63000 is provided. Next, aredistribution stack is formed over the carrier 63000. Referring to FIG.63A, conductive pads 40084 are formed over the carrier 63000. Next, adielectric layer 40024 is formed over the conductive pads 40084 and thecarrier 63000, and an RDL 40026 is formed over the dielectric layer40024. Next, a dielectric layer 40028 is formed over the RDL 40026 andthe dielectric layer 40024, and an RDL 40030 is formed over thedielectric layer 40028. Next, a dielectric layer 40032 is formed overthe RDL 40030 and the dielectric layer 40028, and an RDL 40034 is formedover the dielectric layer 40032. Next, a dielectric layer 40036 isformed over the RDL 40034 and the dielectric layer 40032, and UBMs 40038are formed over the dielectric layer 40036.

Referring next to FIG. 63B, an electronic device 1002 and interposercomponents 63002 are disposed over the redistribution stack of the RDLs40026, 40030, and 40034 and the dielectric layers 40024, 40028, 40032,and 40036, and are electrically connected to the UBMs 40038 throughconnectors 40082 a and 40082 b by, for example, flip-chip mounting.

Next and referring to FIG. 63C, a package body 63004 is formed to coveror encapsulate the electronic device 1002 and the interposer components63002, and is disposed over the redistribution stack of the RDLs 40026,40030, and 40034 and the dielectric layers 40024, 40028, 40032, and40036. The package body 63004 and the interposer components 63002 arenext subjected to grinding, lapping, or another suitable materialremoval technique, thereby forming a package body 40006 and interposercomponents 33070 as shown in FIG. 63D.

Next and referring to FIG. 63E, the package body 40006 and theredistribution stack are separated from the carrier 63000. Electricalcontacts 1040, such as in the form of conductive bumps, are formed overthe conductive pads 40084, and, for embodiments in which an array ofconnected semiconductor device packages are formed, singulation isperformed (as shown by arrows in FIG. 63E) to form individualsemiconductor device packages, including the semiconductor devicepackage 40050. An electronic component 33052 is then electricallyconnected to the semiconductor device package 40050, thereby forming thestacked package assembly 40000 of FIG. 40.

FIG. 64A through FIG. 64D show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The manufacturing process can be referred to as a “chiplast” process. The following manufacturing operations are explained withreference to the semiconductor device package 42050 and the stackedpackage assembly 42000 of FIG. 42. However, it is contemplated that themanufacturing operations can be similarly carried out to form otherstacked package assemblies that are differently configured. Certain ofthe following manufacturing operations can be similarly performed asexplained in the foregoing, and repetition of detailed explanation isomitted.

As shown in FIG. 64A, a carrier 64000 is provided. Next, aredistribution stack is formed over the carrier 64000, includingconductive pads 40084, RDLs 40026, 40030, and 40034, dielectric layers40024, 40028, 40032, and 40036, and UBMs 40038.

Referring next to FIG. 64B, an electronic device 1002 is disposed overthe redistribution stack, and is electrically connected to the UBMs40038 through connectors 40082 a by, for example, flip-chip mounting.Also, conductive posts 42080 are disposed over the redistribution stack,and are electrically connected to the UBMs 40038. The conductive posts42080 can be formed over the UBMs 40038, such as by plating withinopenings of a patterned photoresist layer or another suitable depositiontechnique. It is also contemplated that the conductive posts 42080 canbe pre-formed and then electrically connected to the UBMs 40038, such asusing solder or a conductive adhesive.

Next and referring to FIG. 64C, a package body 64002 is formed to coveror encapsulate the electronic device 1002 and the conductive posts42080, and is disposed over the redistribution stack. The package body64002 is next subjected to grinding, lapping, or another suitablematerial removal technique, thereby forming a package body 42006 asshown in FIG. 64D. The package body 42006 includes a back surface 42022,and at least a portion of a terminal end of each conductive post 42080is exposed from the back surface 42022 of the package body 42006.Subsequent manufacturing operations can be similarly performed asexplained in the foregoing with reference to FIG. 63A through FIG. 63E,thereby forming the semiconductor device package 42050 and the stackedpackage assembly 42000 of FIG. 42.

FIG. 65A through FIG. 65D show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The following manufacturing operations are explainedwith reference to the semiconductor device package 44050 and the stackedpackage assembly 44000 of FIG. 44. However, it is contemplated that themanufacturing operations can be similarly carried out to form otherstacked package assemblies that are differently configured. Certain ofthe following manufacturing operations can be similarly performed asexplained in the foregoing, and repetition of detailed explanation isomitted.

Referring to FIG. 65A, initial manufacturing operations can be similarlyperformed as explained in the foregoing with reference to FIG. 59Athrough FIG. 59F to form a redistribution stack over an active surface1008 of an electronic device 1002 and a front surface 33020 of a packagebody 33006. As shown in FIG. 65A, the redistribution stack includes RDLs33026, 33030, and 33034, dielectric layers 33024, 33028, 33032, and33036, and UBMs 33038.

Next and referring to FIG. 65B, the redistribution stack, the packagebody 33006, the encapsulated electronic device 1002, and encapsulatedinterposer components 33070 are separated from a carrier 59008, and arereoriented and disposed over a carrier 65000, with the active surface1008 of the electronic device 1002 and the front surface 33020 of thepackage body 33006 facing towards the carrier 65000, and a back surface33022 of the package body 33006 facing away from the carrier 65000.

Next, another redistribution stack is formed over the back surface 33022of the package body 33006. As shown in FIG. 65C, a dielectric layer44024 is formed over the back surface 33022 of the package body 33006,and an RDL 44026 is formed over the dielectric layer 44024. Next, adielectric layer 44028 is formed over the RDL 44026 and the dielectriclayer 44024, and an RDL 44030 is formed over the dielectric layer 44028.Next, a dielectric layer 44032 is formed over the RDL 44030 and thedielectric layer 44028, and UBMs 44038 are formed over the dielectriclayer 44032.

Next and referring to FIG. 65D, the package body 33006 and theredistribution stacks are separated from the carrier 65000. Electricalcontacts 1040, such as in the form of conductive bumps, are formed overthe UBMs 33038, and, for embodiments in which an array of connectedsemiconductor device packages are formed, singulation is performed (asshown by arrows in FIG. 65D) to form individual semiconductor devicepackages, including the semiconductor device package 44050. Anelectronic component 44052 is then electrically connected to thesemiconductor device package 44050, thereby forming the stacked packageassembly 44000 of FIG. 44.

FIG. 66A through FIG. 66F show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The following manufacturing operations are explainedwith reference to the semiconductor device package 45050 and the stackedpackage assembly 45000 of FIG. 45. However, it is contemplated that themanufacturing operations can be similarly carried out to form otherstacked package assemblies that are differently configured. Certain ofthe following manufacturing operations can be similarly performed asexplained in the foregoing, and repetition of detailed explanation isomitted.

As shown in FIG. 66A, a carrier 66000 is provided. Next, aredistribution stack is formed over the carrier 66000. As illustrated,conductive pads 45084 are formed over the carrier 66000. Next, adielectric layer 45024 is formed over the conductive pads 45084 and thecarrier 66000, and an RDL 45026 is formed over the dielectric layer45024. Next, a dielectric layer 45028 is formed over the RDL 45026 andthe dielectric layer 45024, and an RDL 45030 is formed over thedielectric layer 45028. Next, a dielectric layer 45032 is formed overthe RDL 45030 and the dielectric layer 45028, and UBMs 45038 are formedover the dielectric layer 45032.

Referring next to FIG. 66B, an electronic device 1002 is disposed overthe redistribution stack of the RDLs 45026 and 45030 and the dielectriclayers 45024, 45028, and 45032, with its back surface 1010 facingtowards the redistribution stack. Conductive posts 45080 are disposedover the electronic device 1002, and extend from respective contact pads1012 of the electronic device 1002. Also, interposer components 66002are disposed over the redistribution stack, and are electricallyconnected to the UBMs 45038 through connectors 45082 by, for example,flip-chip mounting.

Next and referring to FIG. 66C, a package body 66004 is formed to coveror encapsulate the electronic device 1002 and the interposer components66002, and is disposed over the redistribution stack. The package body66004 and the interposer components 66002 are next subjected togrinding, lapping, or another suitable material removal technique,thereby forming a package body 45006 and interposer components 33070 asshown in FIG. 66D. The package body 45006 includes a front surface45020, and terminal ends of conductive vias 33072 of the interposercomponents 33070 and terminal ends of the conductive posts 45080 are atleast partially exposed from the front surface 45020 of the package body45006.

Next, another redistribution stack is formed over the front surface45020 of the package body 45006. As shown in FIG. 66E, a dielectriclayer 33024 is formed over the front surface 45020 of the package body45006, and an RDL 33026 is formed over the dielectric layer 33024. Next,a dielectric layer 33028 is formed over the RDL 33026 and the dielectriclayer 33024, and an RDL 33030 is formed over the dielectric layer 33028.Next, a dielectric layer 33032 is formed over the RDL 33030 and thedielectric layer 33028, and an RDL 33034 is formed over the dielectriclayer 33032. Next, a dielectric layer 33036 is formed over the RDL 33034and the dielectric layer 33032, and UBMs 33038 are formed over thedielectric layer 33036.

Next and referring to FIG. 66F, electrical contacts 1040, such as in theform of conductive bumps, are formed over the UBMs 33038, and, forembodiments in which an array of connected semiconductor device packagesare formed, singulation is performed (as shown by arrows in FIG. 66F) toform individual semiconductor device packages, including thesemiconductor device package 45050. An electronic component 44052 isthen electrically connected to the semiconductor device package 45050,thereby forming the stacked package assembly 45000 of FIG. 45.

FIG. 67A through FIG. 67D show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The following manufacturing operations are explainedwith reference to the semiconductor device package 47050 and the stackedpackage assembly 47000 of FIG. 47. However, it is contemplated that themanufacturing operations can be similarly carried out to form otherstacked package assemblies that are differently configured. Certain ofthe following manufacturing operations can be similarly performed asexplained in the foregoing, and repetition of detailed explanation isomitted.

As shown in FIG. 67A, a carrier 67000 is provided. Next, aredistribution stack is formed over the carrier 67000, includingconductive pads 45084, RDLs 45026 and 45030, dielectric layers 45024,45028, and 45032, and UBMs 45038.

Referring next to FIG. 67B, an electronic device 1002 is disposed overthe redistribution stack, with its back surface 1010 facing towards theredistribution stack, and conductive posts 45080 extend from respectivecontact pads 1012 of the electronic device 1002. Also, conductive posts47080 are disposed over the redistribution stack, and are electricallyconnected to the UBMs 45038. The conductive posts 47080 can be formedover the UBMs 45038, such as by plating within openings of a patternedphotoresist layer or another suitable deposition technique. It is alsocontemplated that the conductive posts 47080 can be pre-formed and thenelectrically connected to the UBMs 45038, such as using solder or aconductive adhesive.

Next and referring to FIG. 67C, a package body 67002 is formed to coveror encapsulate the electronic device 1002 and the conductive posts 45080and 47080, and is disposed over the redistribution stack. The packagebody 67002 is next subjected to grinding, lapping, or another suitablematerial removal technique, thereby forming a package body 47006 asshown in FIG. 67D. The package body 47006 includes a front surface47020, and terminal ends of the conductive posts 45080 and 47080 are atleast partially exposed from the front surface 47020 of the package body47006. Subsequent manufacturing operations can be similarly performed asexplained in the foregoing with reference to FIG. 66A through FIG. 66F,thereby forming the semiconductor device package 47050 and the stackedpackage assembly 47000 of FIG. 47.

FIG. 68A through FIG. 68D show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The following manufacturing operations are explainedwith reference to the semiconductor device package 48050 and the stackedpackage assembly 48000 of FIG. 48. However, it is contemplated that themanufacturing operations can be similarly carried out to form otherstacked package assemblies that are differently configured. Certain ofthe following manufacturing operations can be similarly performed asexplained in the foregoing, and repetition of detailed explanation isomitted.

Referring to FIG. 68A, initial manufacturing operations can be similarlyperformed as explained in the foregoing with reference to FIG. 61Athrough FIG. 61D to form a redistribution stack over an active surface1008 of an electronic device 1002 and a front surface 48020 of a packagebody 48006. As shown in FIG. 68A, the redistribution stack includes RDLs33026, 33030, and 33034, dielectric layers 33024, 33028, 33032, and33036, and UBMs 33038.

Next and referring to FIG. 68B, the redistribution stack, the packagebody 48006, the encapsulated electronic device 1002, and encapsulatedinterposer components 33070 are separated from a carrier 68000, and arereoriented and disposed over a carrier 68002, with the active surface1008 of the electronic device 1002 and the front surface 48020 of thepackage body 48006 facing towards the carrier 68002, and a back surface48022 of the package body 48006 facing away from the carrier 68002.

Next and referring to FIG. 68C, another redistribution stack is formedover the back surface 48022 of the package body 48006, including RDLs44026 and 44030, dielectric layers 44024, 44028, and 44032, and UBMs44038.

Next and referring to FIG. 68D, the package body 48006 and theredistribution stacks are separated from the carrier 68002. Electricalcontacts 1040, such as in the form of conductive bumps, are formed overthe UBMs 33038, and, for embodiments in which an array of connectedsemiconductor device packages are formed, singulation is performed (asshown by arrows in FIG. 68D) to form individual semiconductor devicepackages, including the semiconductor device package 48050. Anelectronic component 44052 is then electrically connected to thesemiconductor device package 48050, thereby forming the stacked packageassembly 48000 of FIG. 48.

FIG. 69A through FIG. 69C show a sequence of stages of a manufacturingprocess of a stacked package assembly, according to some embodiments ofthis disclosure. The following manufacturing operations are explainedwith reference to the semiconductor device package 49050 and the stackedpackage assembly 49000 of FIG. 49. However, it is contemplated that themanufacturing operations can be similarly carried out to form otherstacked package assemblies that are differently configured. Certain ofthe following manufacturing operations can be similarly performed asexplained in the foregoing, and repetition of detailed explanation isomitted.

Referring to FIG. 69A, initial manufacturing operations can be similarlyperformed as explained in the foregoing with reference to FIG. 63Athrough FIG. 63D to form a redistribution stack over a carrier 69000. Asshown in FIG. 69A, the redistribution stack includes conductive pads40084, RDLs 40026, 40030, and 40034, dielectric layers 40024, 40028,40032, and 40036, and UBMs 40038. A package body 49006 is formed tocover or encapsulate an electronic device 1002 and interposer components33070, and is disposed over the redistribution stack. The package body49006 includes a back surface 49022, and terminal ends of conductivevias 33072 of the interposer components 33070 are at least partiallyexposed from the back surface 49022 of the package body 49006.

Next and referring to FIG. 69B, another redistribution stack is formedover the back surface 49022 of the package body 49006, including RDLs44026 and 44030, dielectric layers 44024, 44028, and 44032, and UBMs44038.

Next and referring to FIG. 69C, the package body 49006 and theredistribution stacks are separated from the carrier 69000. Electricalcontacts 1040, such as in the form of conductive bumps, are formed overthe conductive pads 40084, and, for embodiments in which an array ofconnected semiconductor device packages are formed, singulation isperformed (as shown by arrows in FIG. 69C) to form individualsemiconductor device packages, including the semiconductor devicepackage 49050. An electronic component 44052 is then electricallyconnected to the semiconductor device package 49050, thereby forming thestacked package assembly 49000 of FIG. 49.

FIG. 70 shows a stage of a manufacturing process of a stacked packageassembly, according to some embodiments of this disclosure. Thefollowing manufacturing operations are explained with reference to thesemiconductor device package 50050 and the stacked package assembly50000 of FIG. 50. However, it is contemplated that the manufacturingoperations can be similarly carried out to form other stacked packageassemblies that are differently configured. Certain of the followingmanufacturing operations can be similarly performed as explained in theforegoing, and repetition of detailed explanation is omitted.

Referring to FIG. 70, initial manufacturing operations can be similarlyperformed as explained in the foregoing with reference to FIG. 64Athrough FIG. 64D to form a redistribution stack over a carrier 70000. Apackage body 50006 is formed to cover or encapsulate an electronicdevice 1002 and conductive posts 50080, and is disposed over theredistribution stack. The conductive posts 50080 can be formed over theredistribution stack, such as by plating within openings of a patternedphotoresist layer or another suitable deposition technique. It is alsocontemplated that the conductive posts 50080 can be pre-formed and thenelectrically connected to the redistribution stack, such as using solderor a conductive adhesive. The package body 50006 includes a back surface50022, and terminal ends of the conductive posts 50080 are at leastpartially exposed from the back surface 50022 of the package body 50006.Subsequent manufacturing operations can be similarly performed asexplained in the foregoing with reference to FIG. 69A through FIG. 69C,thereby forming the semiconductor device package 50050 and the stackedpackage assembly 50000 of FIG. 50.

As used herein, the singular terms “a,” “an,” and “the” may includeplural referents unless the context clearly dictates otherwise. Thus,for example, reference to an electronic device may include multipleelectronic devices unless the context clearly dictates otherwise.

Spatial descriptions, such as “above,” “below,” “up,” “left,” “right,”“down,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “higher,”“lower,” “upper,” “under,” and so forth, are indicated with respect tothe orientation shown in the figures unless otherwise specified. Itshould be understood that the spatial descriptions used herein are forpurposes of illustration, and that practical implementations of thestructures described herein can be spatially arranged in any orientationor manner, provided that the merits of embodiments of this disclosureare not deviated from by such an arrangement.

As used herein, the terms “approximately,” “substantially,”“substantial” and “about” are used to describe and account for smallvariations. When used in conjunction with an event or circumstance, theterms can refer to instances in which the event or circumstance occursprecisely as well as instances in which the event or circumstance occursto a close approximation. For example, when used in conjunction with anumerical value, the terms can refer to a range of variation of lessthan or equal to ±10% of that numerical value, such as less than orequal to ±5%, less than or equal to ±4%, less than or equal to ±3%, lessthan or equal to ±2%, less than or equal to ±1%, less than or equal to±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05° Forexample, a first numerical value can be deemed to be “substantially” or“about” the same as or equal to a second numerical value if the firstnumerical value is within a range of variation of less than or equal to±10% of the second numerical value, such as less than or equal to ±5%,less than or equal to ±4%, less than or equal to ±3%, less than or equalto ±2%, less than or equal to ±1%, less than or equal to ±0.5%, lessthan or equal to ±0.1%, or less than or equal to ±0.05%. For example, acharacteristic or quantity can be deemed to be “substantially” uniformif a maximum numerical value of the characteristic or quantity is withina range of variation of less than or equal to +10% of a minimumnumerical value of the characteristic or quantity, such as less than orequal to +5%, less than or equal to +4%, less than or equal to +3%, lessthan or equal to +2%, less than or equal to +1%, less than or equal to+0.5%, less than or equal to +0.1%, or less than or equal to +0.05%.

In the description of some embodiments, a component provided “on,”“over,” or “below” another component can encompass cases where theformer component is directly adjoining (e.g., in physical contact with)the latter component, as well as cases where one or more interveningcomponents are located between the former component and the lattercomponent.

As used herein, the terms “connect,” “connected,” “connecting,” and“connection” refer to an operational coupling or linking. Connectedcomponents can be directly coupled to one another or can be indirectlycoupled to one another, such as via another set of components.

Additionally, amounts, ratios, and other numerical values are sometimespresented herein in a range format. It is to be understood that suchrange format is used for convenience and brevity and should beunderstood flexibly to include numerical values explicitly specified aslimits of a range, but also to include all individual numerical valuesor sub-ranges encompassed within that range as if each numerical valueand sub-range is explicitly specified.

While the present disclosure has been described and illustrated withreference to specific embodiments thereof, these descriptions andillustrations are not limiting. It should be understood by those skilledin the art that various changes may be made and equivalents may besubstituted without departing from the true spirit and scope of thepresent disclosure as defined by the appended claims. The illustrationsmay not be necessarily drawn to scale. There may be distinctions betweenthe artistic renditions in the present disclosure and the actualapparatus due to manufacturing processes and tolerances. There may beother embodiments of the present disclosure which are not specificallyillustrated. The specification and drawings are to be regarded asillustrative rather than restrictive. Modifications may be made to adapta particular situation, material, composition of matter, method, orprocess to the objective, spirit and scope of the present disclosure.All such modifications are intended to be within the scope of the claimsappended hereto. While the methods disclosed herein have been describedwith reference to particular operations performed in a particular order,it will be understood that these operations may be combined,sub-divided, or re-ordered to form an equivalent method withoutdeparting from the teachings of the present disclosure. Accordingly,unless specifically indicated herein, the order and grouping of theoperations are not limitations of the present disclosure.

What is claimed is:
 1. A method of forming a semiconductor devicepackage, comprising: providing an electronic device including an activesurface and a contact pad adjacent to the active surface; forming apackage body encapsulating portions of the electronic device; andforming a redistribution stack, including: forming a dielectric layerover a front surface of the package body, the dielectric layer defininga first opening exposing at least a portion of the contact pad; andforming a redistribution layer (RDL) over the dielectric layer, the RDLincluding a first trace, wherein the first trace includes a firstportion extending over the dielectric layer along a first longitudinaldirection adjacent to the first opening, and a second portion disposedin the first opening and extending between the first portion of thefirst trace and the exposed portion of the contact pad, wherein thesecond portion of the first trace has a maximum width along a firsttransverse direction orthogonal to the first longitudinal direction, andthe maximum width of the second portion of the first trace is no greaterthan 3 times of a width of the first portion of the first trace, whereinthe second portion of the first trace is disposed between and spacedfrom opposing sidewalls of the dielectric layer defining the firstopening.
 2. The method of claim 1, wherein the maximum width of thesecond portion of the first trace is no greater than 2.5 times of thewidth of the first portion of the first trace.
 3. The method of claim 1,wherein the maximum width of the second portion of the first trace issubstantially the same as the width of the first portion of the firsttrace.
 4. The method of claim 1, wherein the first opening in thedielectric layer has a maximum width along the first transversedirection, and the maximum width of the second portion of the firsttrace is less than the maximum width of the first opening.
 5. The methodof claim 1, wherein a projection area of the first trace onto thecontact pad is no greater than 15% of a total area of the contact pad.6. The method of claim 1, wherein the RDL further includes at least twoadditional traces extending over the dielectric layer and overlappingthe contact pad disposed below the additional traces.
 7. The method ofclaim 1, wherein the package body further includes a back surfaceopposite to the front surface, the active surface of the electronicdevice is at least partially exposed from the front surface of thepackage body, and the redistribution stack is disposed over the frontsurface of the package body.
 8. The method of claim 7, wherein theelectronic device is a first electronic device, the method furthercomprises providing a second electronic device, the package bodyencapsulates portions of the second electronic device, and the RDLelectrically connects the first electronic device to the secondelectronic device.
 9. The method of claim 7, wherein the method furthercomprises providing an interposer component including a lower surface,an upper surface, and a conductive via extending from the lower surfaceto the upper surface, the package body encapsulates portions of theinterposer component, the lower surface of the interposer component isat least partially exposed from the front surface of the package body,the upper surface of the interposer component is at least partiallyexposed from the back surface of the package body, and the RDLelectrically connects the electronic device to the interposer component.10. The method of claim 9, wherein the dielectric layer defines a secondopening exposing at least a portion of the conductive via, the RDLincludes a second trace, the second trace includes a first portionextending over the dielectric layer along a second longitudinaldirection adjacent to the second opening, and a second portion disposedin the second opening and extending between the first portion of thesecond trace and the exposed portion of the conductive via, the secondportion of the second trace has a maximum width along a secondtransverse direction orthogonal to the second longitudinal direction,and the maximum width of the second portion of the second trace is nogreater than 3 times of a width of the first portion of the secondtrace.
 11. The method of claim 9, wherein the redistribution stack is afirst redistribution stack, and the method further comprises forming asecond redistribution stack disposed over the back surface of thepackage body.
 12. A method of forming a semiconductor device package,comprising: providing an electronic device including an active surfaceand a contact pad adjacent to the active surface; providing a conductivepost over the contact pad of the electronic device; forming a packagebody encapsulating portions of the electronic device and portions of theconductive post, wherein the package body includes a front surface and aback surface opposite to the front surface, and the conductive postextends between the contact pad of the electronic device and the frontsurface of the package body; and forming a redistribution stack,including: forming a dielectric layer over the front surface of thepackage body, the dielectric layer defining a first opening exposing atleast a portion of a terminal end of the conductive post; and forming anRDL over the dielectric layer, the RDL including a first trace, whereinthe first trace includes a first portion extending over the dielectriclayer, and a second portion disposed in the first opening and extendingbetween the first portion of the first trace and the exposed portion ofthe terminal end of the conductive post, wherein the first portion ofthe first trace extends over the dielectric layer along a longitudinaldirection adjacent to the first opening, the second portion of the firsttrace has a maximum width along a transverse direction orthogonal to thelongitudinal direction, and the maximum width of the second portion ofthe first trace is no greater than 3 times of a width of the firstportion of the first trace, wherein the second portion of the firsttrace is disposed between and spaced from opposing sidewalls of thedielectric layer defining the first opening.
 13. The method of claim 12,wherein a projection area of the first trace onto the terminal end ofthe conductive post is no greater than 15% of a total area of theterminal end of the conductive post.
 14. The method of claim 12, whereina projection area of the first trace onto the terminal end of theconductive post is no greater than 10% of a total area of the terminalend of the conductive post.
 15. The method of claim 12, wherein the RDLfurther includes at least two additional traces extending over thedielectric layer and overlapping the terminal end of the conductive postdisposed below the additional traces.
 16. The method of claim 12,wherein the electronic device is a first electronic device, the methodfurther comprises providing a second electronic device, the package bodyencapsulates portions of the second electronic device, and the RDLelectrically connects the first electronic device to the secondelectronic device.
 17. The method of claim 12, wherein the conductivepost is a first conductive post, the method further comprises providinga second conductive post and an interposer component, the interposercomponent includes a conductive via, the package body encapsulatesportions of the interposer component, the second conductive post extendsbetween the conductive via of the interposer component and the frontsurface of the package body, and the RDL electrically connects theelectronic device to the interposer component.
 18. The method of claim17, wherein the dielectric layer defines a second opening exposing atleast a portion of a terminal end of the second conductive post, the RDLincludes a second trace, the second trace includes a first portionextending over the dielectric layer, and a second portion disposed inthe second opening and extending between the first portion of the secondtrace and the exposed portion of the terminal end of the secondconductive post, and a projection area of the second trace onto theterminal end of the second conductive post is no greater than 15% of atotal area of the terminal end of the second conductive post.
 19. Themethod of claim 17, wherein the redistribution stack is a firstredistribution stack, and the method further comprises forming a secondredistribution stack disposed over the back surface of the package body.20. The method of claim 12, wherein the conductive post is a firstconductive post, the method further comprises providing a secondconductive post extending between the front surface of the package bodyand the back surface of the package body, and the RDL electricallyconnects the electronic device to the second conductive post.
 21. Themethod of claim 20, wherein the redistribution stack is a firstredistribution stack, and the method further comprises forming a secondredistribution stack disposed over the back surface of the package body.22. The method of claim 12, wherein the method further comprisesproviding an interposer component including a lower surface, an uppersurface, and a conductive via extending from the lower surface to theupper surface, the package body encapsulates portions of the interposercomponent, the lower surface of the interposer component is at leastpartially exposed from the front surface of the package body, and theRDL electrically connects the electronic device to the interposercomponent.
 23. The method of claim 22, wherein the redistribution stackis a first redistribution stack, and the method further comprisesforming a second redistribution stack disposed over the back surface ofthe package body.
 24. A method of forming a semiconductor devicepackage, comprising: providing a package body including a front surfaceand a back surface opposite to the front surface; and forming aredistribution stack adjacent to the front surface of the package body,including: forming a first RDL including a first trace; forming adielectric layer disposed over the first RDL; and forming a second RDLincluding a second trace extending over the dielectric layer andelectrically connected to the first trace through the dielectric layer,wherein a width of the first trace is substantially uniform along atleast a length of the first trace overlapping the second trace disposedover the first trace, wherein the dielectric layer defines an openingexposing a portion of the first trace, and the exposed portion of thefirst trace is disposed between and spaced from opposing sidewalls ofthe dielectric layer defining the opening.
 25. The method of claim 24,wherein the second trace includes a first portion extending over thedielectric layer along a longitudinal direction adjacent to the opening,and a second portion disposed in the opening and extending between thefirst portion of the second trace and the exposed portion of the firsttrace, the second portion of the second trace has a maximum width alonga transverse direction orthogonal to the longitudinal direction, and themaximum width of the second portion of the second trace is no greaterthan 3 times of a width of the first portion of the second trace. 26.The method of claim 25, wherein the second portion of the second tracecovers a top surface and opposing side surfaces of the exposed portionof the first trace.
 27. The method of claim 24, wherein the second traceis electrically connected to the first trace through the opening in thedielectric layer, the first trace extends along a first directionadjacent to the opening, the second trace extends over the dielectriclayer along a second direction adjacent to the opening, and the seconddirection forms an intersecting angle with the first direction.
 28. Themethod of claim 27, wherein the intersecting angle is different from 0°and different from 180°.
 29. The method of claim 24, wherein theredistribution stack is a first redistribution stack, and the methodfurther comprises forming a second redistribution stack adjacent to theback surface of the package body.
 30. The method of claim 29, whereinthe method further comprises providing an interposer component includinga conductive via, the package body encapsulates portions of theinterposer component, and the first redistribution stack is electricallyconnected to the second redistribution stack through the conductive viaof the interposer component.
 31. The method of claim 29, wherein themethod further comprises providing a conductive post extending betweenthe front surface of the package body and the back surface of thepackage body, and the first redistribution stack is electricallyconnected to the second redistribution stack through the conductivepost.
 32. A method of forming a semiconductor device package,comprising: providing a package body including a front surface and aback surface opposite to the front surface; and forming a redistributionstack adjacent to the front surface of the package body, including:forming an RDL including a trace; forming a dielectric layer disposedover the RDL; and forming an under bump metallization (UBM) disposedover the dielectric layer and electrically connected to the tracethrough the dielectric layer, wherein a portion of the trace overlaps aprojection area of the UBM onto the RDL, the trace extends along alongitudinal direction adjacent to the projection area, the overlappingportion of the trace has a maximum width along a transverse directionorthogonal to the longitudinal direction, the UBM has a maximum widthalong the transverse direction, and the maximum width of the overlappingportion of the trace is no greater than ⅓ of the maximum width of theUBM, wherein the dielectric layer defines an opening exposing a portionof the trace, and the exposed portion of the trace is disposed betweenand spaced from opposing sidewalls of the dielectric layer defining theopening.
 33. The method of claim 32, wherein the maximum width of theoverlapping portion of the trace is no greater than ¼ of the maximumwidth of the UBM.
 34. The method of claim 32, wherein the RDL furtherincludes at least two additional traces extending within the projectionarea of the UBM.
 35. The method of claim 32, wherein the maximum widthof the overlapping portion of the trace is no greater than 3 times of awidth of a remaining portion of the trace disposed outside of theprojection area of the UBM.
 36. The method of claim 32, wherein themethod further comprises providing an electronic device and a connector,the package body encapsulates portions of the electronic device and theconnector, the electronic device includes a contact pad, and theconnector extends between the contact pad of the electronic device andthe UBM.
 37. The method of claim 32, wherein the redistribution stack isa first redistribution stack, and the method further comprises forming asecond redistribution stack adjacent to the back surface of the packagebody.
 38. The method of claim 37, wherein the method further comprisesproviding an interposer component including a conductive via, thepackage body encapsulates portions of the interposer component, and thefirst redistribution stack is electrically connected to the secondredistribution stack through the conductive via of the interposercomponent.
 39. The method of claim 37, wherein the method furthercomprises providing a conductive post extending between the frontsurface of the package body and the back surface of the package body,and the first redistribution stack is electrically connected to thesecond redistribution stack through the conductive post.
 40. A method offorming a semiconductor device package, comprising: forming aredistribution stack, including: forming a conductive pad; forming adielectric layer, wherein the conductive pad is at least partiallyembedded in the dielectric layer; and forming an RDL including a traceextending over the dielectric layer and electrically connected to theconductive pad through an opening in the dielectric layer; and forming apackage body including a front surface and a back surface opposite tothe front surface, the front surface of the package body adjacent to theredistribution stack, wherein the opening in the dielectric layerexposes a portion of the conductive pad, the trace includes a firstportion extending over the dielectric layer along a longitudinaldirection adjacent to the opening, and a second portion disposed in theopening and extending between the first portion of the trace and theexposed portion of the conductive pad, the second portion of the tracehas a maximum width along a transverse direction orthogonal to thelongitudinal direction, and the maximum width of the second portion ofthe trace is no greater than 3 times of a width of the first portion ofthe trace, wherein the second portion of the trace is disposed betweenand spaced from opposing sidewalls of the dielectric layer defining theopening.
 41. The method of claim 40, wherein a projection area of thetrace onto the conductive pad is no greater than 15% of a total area ofthe conductive pad.
 42. The method of claim 40, wherein a projectionarea of the trace onto the conductive pad is no greater than 10% of atotal area of the conductive pad.
 43. The method of claim 40, whereinthe RDL further includes at least two additional traces extending overthe dielectric layer and overlapping the conductive pad disposed belowthe additional traces.
 44. The method of claim 40, wherein the methodfurther comprises providing an electronic device and a connector, thepackage body encapsulates portions of the electronic device and theconnector, the electronic device includes a contact pad, and theconnector extends between the contact pad of the electronic device andthe redistribution stack.
 45. The method of claim 40, wherein theredistribution stack is a first redistribution stack, and the methodfurther comprises forming a second redistribution stack adjacent to theback surface of the package body.
 46. The method of claim 45, whereinthe method further comprises providing an interposer component includinga conductive via, the package body encapsulates portions of theinterposer component, and the first redistribution stack is electricallyconnected to the second redistribution stack through the conductive viaof the interposer component.
 47. The method of claim 45, wherein themethod further comprises providing a conductive post extending betweenthe front surface of the package body and the back surface of thepackage body, and the first redistribution stack is electricallyconnected to the second redistribution stack through the conductivepost.